Semiconductor Device Terminal Anchor Effect
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Solution Overview
Problem
The reliability of semiconductor devices is compromised due to stress concentration and crack formation in the case caused by differential expansion and contraction of connecting terminals and the resin case during thermal cycling, leading to potential weak points and reduced mechanical strength.
Innovation Solution
A semiconductor device design featuring a connecting terminal with a rough-surfaced area on its rear surface, which is embedded in the case during insert molding, allowing the resin to fill microasperities and provide an anchor effect, thereby distributing stress evenly across the terminal arrangement portion and reducing the likelihood of crack initiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connecting terminals are embedded in the resin case by insert molding, then electrical connection and mechanical support are achieved, but stress concentration occurs at weak points causing cracks to appear and grow
Solution Approach 1:
The invention applies local quality by creating a rough-surfaced area on the rear surface of the internal terminal portion through resin embedding. This localized rough surface treatment concentrates the stress-distributing effect at the critical embedding interface, while leaving other areas of the terminal and case unchanged. The rough surface is specifically positioned where the terminal contacts the case to maximize stress distribution benefits at the most vulnerable location.
Solution Approach 2:
The rough-surfaced area acts as a beforehand cushioning mechanism by creating microasperities that will absorb and distribute stress before cracks can initiate. The resin embedding process prepares the surface in advance to have stress-absorbing characteristics, so when thermal expansion and contraction occur during operation, the stress is already distributed through the microasperities rather than concentrating at a smooth surface interface.
2Ease of manufacture
If the case is formed by insert molding with connecting terminals, then assembly is integrated and manufacturing is simplified, but differential expansion and contraction during thermal cycling causes stress concentration
Solution Approach 1:
The invention applies local quality by creating a rough-surfaced area on the rear surface of the internal terminal portion through resin embedding. This localized rough surface treatment concentrates the stress-distributing effect at the critical embedding interface, while leaving other areas of the terminal and case unchanged. The rough surface is specifically positioned where the terminal contacts the case to maximize stress distribution benefits at the most vulnerable location.
Solution Approach 2:
The invention changes the surface parameter of the terminal's rear surface from smooth to rough through the insert molding process. This parameter change (surface roughness) is applied specifically to the embedding interface to modify how stress is transmitted between the terminal and case during thermal cycling, without changing other parameters of the components.
3Reliability
If connecting terminals are rigidly fixed in the case, then electrical connection is secure, but stress concentrates at weak points like corners and scars during thermal changes
Solution Approach 1:
The invention applies local quality by creating a rough-surfaced area on the rear surface of the internal terminal portion through resin embedding. This localized rough surface treatment concentrates the stress-distributing effect at the critical embedding interface, while leaving other areas of the terminal and case unchanged. The rough surface is specifically positioned where the terminal contacts the case to maximize stress distribution benefits at the most vulnerable location.
Solution Approach 2:
The rough-surfaced area acts as a beforehand cushioning mechanism by creating microasperities that will absorb and distribute stress before cracks can initiate. The resin embedding process prepares the surface in advance to have stress-absorbing characteristics, so when thermal expansion and contraction occur during operation, the stress is already distributed through the microasperities rather than concentrating at a smooth surface interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The even stress distribution across the terminal arrangement portion of the case reduces stress concentration at weak points, minimizing the risk of crack development and enhancing the reliability and mechanical strength of the semiconductor device.
Implementation Method 1
A semiconductor device design featuring a connecting terminal with a rough-surfaced area on its rear surface, which is embedded in the case during insert molding, allowing the resin to fill microasperities and provide an anchor effect
Data Source
AI summary
A semiconductor includes a semiconductor element, a connecting terminal electrically connected to the semiconductor element, and a case including an opening space for housing the semiconductor element, a frame which surrounds the opening space and in which the connecting terminal is partially embedded, and a terminal arrangement portion protruding from the frame towards the opening space. The connecting terminal includes an internal terminal portion that extends towards the opening space with respect to the frame, the internal terminal portion having a front surface that is electrically connected to the semiconductor element and exposed to the opening space, and a rear surface that is fixed to the terminal arrangement portion.