Semiconductor Module Terminal Anti-Adhesion Structure
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Solution Overview
Problem
Conventional semiconductor modules face issues with epoxy resin adhesion to terminals handling large currents or high voltages, leading to increased contact resistance and reduced efficiency in driving loads such as motors.
Innovation Solution
A semiconductor module design featuring a sealing section of epoxy resin and an intermediate terminal with a fastening surface intersecting the sealing section, accompanied by a structure that includes gate signal output terminals and current detection terminals positioned higher than the sealing section, preventing epoxy resin droplets from adhering to the terminals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy resin is used as sealing material, then sealing performance is improved, but adhesion to terminals increases contact resistance
Solution Approach 1:
A resin non-adhesion protrusion is introduced as an intermediary structure between the epoxy resin sealing material and the terminal. This protrusion prevents direct contact and adhesion between the epoxy resin and terminal surface, thereby maintaining low contact resistance while preserving the sealing function of the epoxy resin.
Solution Approach 2:
The solution introduces a dimensional element by adding a protrusion that extends from the terminal surface into the sealing space. This vertical dimension creates a physical barrier that prevents the epoxy resin from adhering to the terminal, solving the adhesion problem without compromising sealing performance.
2Reliability
If epoxy resin seals terminals, then sealing is improved, but detection of adhesion becomes difficult
Solution Approach 1:
The resin non-adhesion protrusion provides a visible structural feature that indicates the presence of the anti-adhesion mechanism. This structural change makes it easier to visually confirm that the terminal is protected from epoxy resin adhesion, improving detectability during inspection.
3Reliability
If epoxy resin adheres to terminals, then sealing coverage is improved, but current flow efficiency decreases
Solution Approach 1:
The resin non-adhesion protrusion acts as an intermediary structure that maintains electrical contact between the terminal and cable while preventing epoxy resin adhesion. This ensures efficient current flow through the terminal-cable connection while the epoxy resin still provides comprehensive sealing coverage.
Solution Approach 2:
The terminal structure is segmented into different functional zones: the protrusion portion that contacts the cable for electrical conduction, and the remaining terminal surface that is sealed by epoxy resin. This segmentation allows simultaneous achievement of low contact resistance and comprehensive sealing.
Data Source
AI summary
There is provided a semiconductor module capable of preventing the adhesion of an epoxy resin to terminals to which at least one of a large current and a high voltage is supplied. A semiconductor module includes: a sealing section formed of an epoxy resin and sealing transistors; an intermediate terminal having a fastening surface to which a cable connected to a load as a drive target is fastened in a direction intersecting the thickness direction of a sealing section and connected to the transistors; and a structure arranged between the sealing section and the fastening surface and having an input section higher than a surface of the sealing section and the fastening surface.