Semiconductor Device Terminal Arrangement for Miniaturization
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Solution Overview
Problem
Conventional semiconductor devices have longer current paths due to folded-back portions, which increase device dimensions and hinder miniaturization.
Innovation Solution
The semiconductor device design features output terminals protruding in an opposite direction to ground terminals, with power supply terminals positioned orthogonally to both, eliminating the need for folded-back portions and reducing current path lengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If folded-back portions are added to current paths to change current flow direction, then the current paths can connect terminals, but the current path length increases and device dimension increases
Solution Approach 1:
The patent applies dimensional change by arranging terminals in three-dimensional space rather than a single plane. Output terminals protrude in one direction from the device main body while input terminals protrude in opposite directions, creating a three-dimensional terminal arrangement. This spatial distribution eliminates the need for folded-back current paths and reduces overall current path length within the device.
2Ease of operation
If folded-back portions are added to current paths, then current flow direction can be changed, but the device dimension in the terminal arrangement direction increases
Solution Approach 1:
The patent uses three-dimensional terminal arrangement where output terminals extend in one direction and input terminals extend in opposite directions from the device main body. This spatial configuration allows current to flow directly between terminals without requiring folded-back portions, thereby controlling current flow direction while minimizing device dimension.
3Ease of operation
If folded-back portions are present in current paths, then current can flow between terminals, but places for folded-back portions are required in the device main body
Solution Approach 1:
The patent extracts the current path routing function from the device main body by extending terminals externally in opposite directions. This eliminates the need for complex folded-back portions within the device main body, simplifying the internal structure while maintaining current path formation capability.
4Ease of manufacture
If conventional terminal arrangement is used with all terminals protruding in the same direction, then manufacturing is simplified, but current path length increases
Solution Approach 1:
The patent transitions from a two-dimensional terminal arrangement (all terminals in the same direction) to a three-dimensional arrangement where output terminals and input terminals protrude in opposite directions. This spatial optimization reduces current path length while maintaining manufacturing feasibility through standardized opposite-direction extension processes.
Data Source
AI summary
A semiconductor device (10) of the present invention includes at least one circuit unit (41, 42, 43) which includes: a device main body (20); and a power supply terminal (31, 32, 33), an output terminal (34, 35, 36), and a ground terminal (37, 38, 39) which protrude from the device main body (20). The output terminal (34, 35, 36) protrudes from the device main body (20) in an opposite direction to the ground terminal (37, 38, 39). The power supply terminal (31, 32, 33) protrudes in a same direction as the ground terminal (37, 38, 39) and is positioned so as to be shifted in a direction orthogonal to an arrangement direction of the output terminal (34, 35, 36) and the ground terminal (37, 38, 39).