Semiconductor Wiring Terminal Case Structure to Prevent Bond Peeling
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Solution Overview
Problem
In semiconductor devices, the bending of wiring terminals during assembly can cause mechanical stress, leading to peeling off from the metal plate, compromising the reliability of the bonding unit.
Innovation Solution
A semiconductor device design featuring a case with separate first and second case units that sandwich a wiring terminal, where the second wiring unit is bent outside the case, preventing mechanical force from being applied to the bonding unit between the wiring terminal and the semiconductor element or substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the wiring terminal is bent after the case is bonded to the mounting substrate, then the wiring terminal can be positioned outside the case, but mechanical force is applied to the bonding unit causing peeling off
Solution Approach 1:
The wiring terminal is bent to the outside of the case before the case is bonded to the mounting substrate. This preliminary action allows the wiring terminal to be positioned outside the case without applying mechanical force to the bonding unit during assembly, thereby preventing peeling off and ensuring bonding reliability.
2Shape
If the wiring terminal is bent during assembly, then the wiring terminal can be routed outside the case, but stress is applied to the bonding unit between the wiring terminal and the semiconductor element
Solution Approach 1:
The wiring terminal is bent to the desired configuration outside the case before the case is bonded to the mounting substrate. This ensures that the wiring terminal achieves its final shape without applying stress to the bonding unit between the wiring terminal and the semiconductor element, maintaining bonding strength.
3Ease of operation
If the wiring terminal is bent after bonding, then the wiring terminal can be exposed outside the case, but the bonding unit between the wiring terminal and the substrate is compromised
Solution Approach 1:
The wiring terminal is bent to the outside of the case before the case is bonded to the mounting substrate. This preliminary positioning ensures that the wiring terminal is accessible outside the case while preventing mechanical force from being applied to the bonding unit during assembly, thereby maintaining bonding integrity and manufacturing precision.
Data Source
AI summary
A semiconductor device includes a base plate, a substrate, a semiconductor element, a case, and a wiring terminal. The case is disposed on the base plate so as to cover the substrate and the semiconductor element. The wiring terminal is electrically connected to the semiconductor element. The case includes a first case unit and a second case unit that is separate from the first case unit. The wiring terminal includes a first wiring unit and a second wiring unit. The first wiring unit is disposed so as to protrude from an inside to an outside of the case, and is electrically connected to the semiconductor element. The second wiring unit is bent with respect to the first wiring unit and disposed outside the case. The first case unit and the second case unit are disposed so as to sandwich the first wiring unit.