Semiconductor Terminal Buckling Part Stress Absorption
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Solution Overview
Problem
Conventional power semiconductor modules face issues with stress-induced damage to insulating substrates during manufacturing, leading to degradation of insulating properties and reduced reliability due to low bending strength of ceramics used in substrates.
Innovation Solution
Incorporating a buckling part or expanding and contracting part in the external connection terminal, which absorbs excessive stress and reduces the pressure applied to the insulating substrate, preventing damage by allowing the terminal to buckle and compress, thereby distributing the load effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional rigid external connection terminal is used, then the structural strength is maintained, but excessive stress is applied to the insulating substrate causing damage
Solution Approach 1:
The external connection terminal incorporates a buckling part that allows controlled deformation under stress. This flexible design element absorbs excessive stress through buckling rather than transmitting it to the insulating substrate, preventing substrate damage while maintaining overall structural integrity
Solution Approach 2:
The terminal's geometric parameters are modified by introducing a buckling part with specific dimensions (depth d1, width w1, thickness t1). This structural parameter change enables the terminal to undergo controlled deformation, transforming it from a rigid stress-transmitting component to a stress-absorbing component that protects the substrate
2Object-affected harmful factors
If the external connection terminal is made more flexible to reduce stress, then substrate damage is prevented, but the terminal may become too weak to support external loads
Solution Approach 1:
The terminal structure applies local quality by concentrating the flexibility in a specific region (the buckling part) rather than making the entire terminal flexible. The buckling part has optimized dimensions (depth d1, width w1, thickness t1) that provide controlled deformation capability, while other portions of the terminal maintain sufficient rigidity to support external loads
3Object-affected harmful factors
If stress absorption features are added to the terminal, then substrate protection is improved, but the device complexity increases
Solution Approach 1:
The terminal is segmented into distinct functional regions: a rigid portion for load-bearing and connection, and a buckling part for stress absorption. This segmentation allows each portion to be optimized for its specific function while maintaining overall simplicity. The buckling part itself is a single integrated structural element rather than multiple components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces stress on the insulating substrate, preventing damage and maintaining the module's reliability by absorbing external loads and minimizing warping, while ensuring good heat dissipation without excess resin.
Implementation Method 1
The external connection terminal has a buckling part or an expanding and contracting part. The buckling part is a part of the external connection terminal, the part having the notch. In the external connection terminal, an angle of the buckling part is in a range from 120 degrees to 177 degrees.
Implementation Method 2
The expanding and contracting part is a bonding member provided between the conductive plate and the terminal. The expanding and contracting part is provided between the conductive plate and the lower conductive plate, and between the upper conductive plate and the lower conductive plate.
Data Source
AI summary
A semiconductor device includes a conductive plate to which a semiconductor element is mounted on a front surface; a sealing resin internally encapsulating at least the front surface of the conductive plate and the semiconductor element; and an external connection terminal connected to the conductive plate and exposed outside the sealing resin. The external connection terminal has a buckling portion or an expanding and contracting portion. The external connection terminal may have a notch and the buckling portion is a part having the notch.