Semiconductor Device Terminal Bundling for Miniaturization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional inverter devices face challenges in miniaturization due to increased horizontal width and long current routes, leading to high wiring resistance and efficiency decline.
Innovation Solution
A semiconductor device configuration with a specific arrangement of conductive parts and terminals on an insulating substrate, including a first conductive part extending in one direction, a second conductive part separated and extending in the same direction, and third conductive parts lined between them, with switches and terminals strategically positioned to reduce wiring length and resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If power supply terminals and ground terminals are not bundled into one, then device layout flexibility is improved, but horizontal width increases and miniaturization becomes difficult
Solution Approach 1:
The patent combines power supply terminals and ground terminals into a bundled arrangement where multiple terminals of the same type are grouped together and connected through shared conductive paths. This merging approach reduces the overall horizontal width by eliminating redundant separate connections while maintaining layout flexibility through the modular bundled structure.
Solution Approach 2:
The patent implements universal conductive parts that serve multiple functions: they act as both power supply connections and ground connections depending on their position in the bundle, and serve as both internal wiring and external terminal connections. This multi-functionality reduces the number of dedicated conductors needed, thereby reducing horizontal width while preserving adaptability.
2Area of stationary object
If power supply block and ground block are adjacently arranged, then device area is reduced, but current route becomes long and wiring resistance increases
Solution Approach 1:
The patent transitions from a planar adjacent arrangement to a three-dimensional bundled structure where power and ground terminals are vertically stacked and interconnected through conductive parts extending in multiple directions. This dimensional change allows compact area utilization while maintaining short current paths through the vertical conductive connections within the bundle.
Solution Approach 2:
The patent nests conductive parts within the terminal bundle structure, where internal conductive elements are positioned within the outer envelope of the terminal assembly. This nesting allows the current paths to be contained within a compact volume, reducing the horizontal spread while keeping current routes short through the nested conductive layers.
Data Source
AI summary
The semiconductor device 1 includes an insulating substrate 2, a conductive part 3 that extends in a first direction, a conductive part 4 that is separated in a second direction and extends in the first direction, conductive parts 5 that are lined along the first direction between the part 3 and the part 4, high-side switches 11, 12 and 13, low-side switches 14, 15 and, signal terminals that are arrayed along the first direction, a power supply terminal 21 that is electrically connected to the part 3, a ground terminal 22 that is electrically connected to the part 4, and output terminals 23, 24 and 25 that are electrically connected respectively to the corresponding parts 5, arrayed along the first direction on the other end side of the substrate 2, and provided over a straight line L that passes through the part 4 and extends in the first direction.