Semiconductor Device Terminal Heat Dissipation via Conductor Substrates
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Solution Overview
Problem
Existing semiconductor devices face challenges in efficiently dissipating heat from the upper surface, which is more difficult to dissipate than the lower surface, and require insulating sheets that complicate cooler attachment and positional accuracy, leading to potential gaps and reduced heat dissipation.
Innovation Solution
A semiconductor device design featuring a substrate unit with insulating and conductor substrates, where a terminal connects the semiconductor element from the upper surface to the lower surface, allowing direct heat dissipation and improving the device's flatness for easier cooler attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a metal plate is connected to the top surface of the semiconductor element to dissipate heat, then heat dissipation from the upper surface is improved, but the overall heat dissipation efficiency deteriorates due to the high thermal resistance of the semiconductor element
Solution Approach 1:
The invention divides the heat dissipation function into two separate paths: one for the upper surface (via terminal 5) and one for the lower surface (via substrate unit 1). This segmentation allows each path to be optimized independently, with the upper surface heat dissipation not being hindered by the thermal resistance of the semiconductor element body.
Solution Approach 2:
The terminal 5 acts as an intermediary heat conduction path that bypasses the semiconductor element body. By providing this alternative heat transfer route, the terminal enables efficient heat dissipation from the upper surface without being constrained by the high thermal resistance of the semiconductor element.
2Reliability
If an insulating sheet is disposed to electrically insulate metal bodies from each other, then electrical insulation is improved, but positional accuracy in connecting the cooler deteriorates
Solution Approach 1:
The invention extracts the insulating function from the mechanical interface between metal bodies. By placing the insulating sheet only where electrically conductive parts are in close proximity (at the bottom of the groove), the design removes insulating material from the cooler attachment surface, thereby improving positional accuracy and attachment reliability.
Solution Approach 2:
The insulating sheet is applied locally only where electrical insulation is critically needed (at the bottom of the groove between conductive parts), rather than universally across all metal body interfaces. This localized application maintains electrical insulation where required while preserving mechanical precision where attachment occurs.
3Ease of operation
If both metal bodies are disposed on the same plane to ensure parallelism, then ease of cooler attachment is improved, but a gap may form between the metal body and heat sink, reducing heat dissipation
Solution Approach 1:
The second metal body is nested within a groove of the substrate unit, with its top surface positioned lower than the top surface of the substrate. This nested configuration allows the cooler to attach to the outer surface of the substrate unit while the second metal body remains properly positioned for heat dissipation, eliminating gaps without compromising parallelism.
Solution Approach 2:
The invention addresses the parallelism issue by moving the second metal body to a different vertical dimension (lower position in the groove) rather than keeping it on the same plane. This dimensional adjustment allows both metal bodies to be properly positioned for their respective functions without creating gaps that would reduce heat dissipation efficiency.
4Temperature
If the terminal extends from the upper surface to the lower surface of the semiconductor element, then heat dissipation path is improved, but device complexity increases
Solution Approach 1:
The terminal 5 serves multiple functions: it provides electrical connection for the semiconductor element, acts as a heat dissipation path from the upper surface, and contributes to the structural integrity of the device. By combining these functions in a single component, the design avoids increasing overall device complexity while achieving improved heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation from the upper surface to the lower surface, improves the device's flatness, and simplifies cooler attachment, resulting in more efficient heat transfer and increased reliability.
Implementation Method 1
The first conductor substrate and the second conductor substrate which are disposed on one main surface of the insulating substrate and spaced apart from each other, and a third conductor substrate which is disposed on the other main surface opposite to the one main surface
Data Source
AI summary
In semiconductor device, a substrate unit includes an insulating substrate, a first conductor substrate and a second conductor substrate which are disposed on one main surface of the insulating substrate and spaced apart from each other, and a third conductor substrate which is disposed on the other main surface opposite to the one main surface of the insulating substrate. A terminal is connected to a surface of a semiconductor element opposite to the first conductor substrate. The terminal extends from a region above the semiconductor element to a region above the second conductor substrate while being connected to the second conductor substrate. At least a part of the terminal, the substrate unit and the semiconductor element is sealed by a resin. The third conductor substrate is exposed from the resin.