Semiconductor Package Connection Terminal Structure for Contact Reliability
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing demand for miniaturization, multi-functionalization, and high performance in electronic products poses challenges for semiconductor packages in terms of reduced form factors, increased integration, performance, and speed, requiring improved contact reliability of connection terminals to enhance memory bandwidth.
Innovation Solution
A semiconductor chip and package design that includes a semiconductor substrate with a wiring layer, connection pads, protective insulating layers, and connection terminals. The design features a pillar barrier layer, a conductive pillar with a base and cap, and an inorganic upper cover insulating layer to improve contact reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number and density of connection bumps are increased to enhance memory bandwidth, then the data transmission capability is improved, but the contact reliability of connection terminals deteriorates due to increased complexity and density
Solution Approach 1:
The connection terminal is segmented into multiple functional layers: a lower protective insulating layer, an upper protective insulating layer, and an upper cover insulating layer. This segmentation allows each layer to perform its specific function while collectively ensuring stable electrical connection, thereby maintaining contact reliability even as connection density increases
Solution Approach 2:
The patent employs composite insulating layer structures combining different materials with complementary properties. The lower protective insulating layer provides mechanical protection, while the upper protective insulating layer and upper cover insulating layer provide electrical isolation and environmental protection, creating a reliable multi-functional protection system for high-density connections
2Area of stationary object
If the density of connection terminals is increased to reduce form factor, then the integration is improved, but the manufacturing precision required for reliable contact decreases
Solution Approach 1:
The lower protective insulating layer is formed beforehand to define precise opening patterns that guide the formation of connection terminals. This preliminary structuring establishes accurate alignment references before subsequent processing steps, ensuring manufacturing precision is maintained even as connection density increases
Solution Approach 2:
The upper cover insulating layer acts as an intermediary element between the connection terminal and the upper protective insulating layer. It provides a buffer zone that compensates for minor alignment variations and ensures reliable electrical connection, thereby reducing the stringency of manufacturing precision requirements
Data Source
AI summary
A semiconductor chip includes a semiconductor substrate including an active surface and an inactive surface opposite to the active surface, a wiring layer on the active surface, a front connection pad on the wiring layer, a lower protective insulating layer at least partially covering the wiring layer and including a lower opening that exposes at least a portion of the front connection pad, an upper protective insulating layer including an upper opening communicatively coupled to the lower opening on the lower protective insulating layer, a connection terminal coupled to the front connection pad through the lower opening and the upper opening, and an upper cover insulating layer between the connection terminal and the upper protective insulating layer. The upper protective insulating layer includes an organic material. The upper cover insulating layer includes an inorganic material.