Semiconductor Terminal Geometry for Sealing Resin Crack Resistance
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Solution Overview
Problem
The concentration of thermal stress at the boundary portion between the main surface and end surface of the conductive member in semiconductor devices leads to cracks in the sealing resin, which is prone to failure.
Innovation Solution
The semiconductor device design includes terminals with specific surface configurations, such as convex and concave surfaces, to distribute thermal stress more uniformly and increase the contact area with the sealing resin, reducing the likelihood of cracks and improving mounting strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the conductive member has a protruding portion with a sharp boundary between main surface and end surface, then the mounting strength is improved, but thermal stress concentrates at the boundary portion causing cracks in the sealing resin
Solution Approach 1:
The patent applies curvature by forming a rounded boundary portion between the main surface and end surface of the protruding portion, replacing the sharp corner with a curved surface. This curvature distributes thermal stress uniformly across the rounded surface, preventing stress concentration that would cause cracks in the sealing resin, while maintaining adequate mounting strength through the protruding structure
2Strength
If the boundary portion is made sharper to improve mounting strength, then adhesion increases, but thermal stress concentration increases causing sealing resin failure
Solution Approach 1:
The sharp boundary is replaced with a curved boundary surface that maintains contact with the sealing resin for adequate adhesion while distributing thermal stress. The curvature radius is controlled to balance adhesion requirements with stress distribution, preventing both detachment and crack formation
Data Source
AI summary
A semiconductor device includes: a terminal having a connection surface facing one side in a first direction; a semiconductor element electrically connected to the connection surface; and a sealing resin covering a portion of the terminal and the semiconductor element, wherein the terminal is located on the other side in the first direction with respect to the connection surface and has a first surface recessed into the terminal and a second surface connected to the connection surface and the first surface, wherein the first surface overlaps the connection surface when viewed in the first direction, and wherein the second surface is convex and is in contact with the sealing resin.