Semiconductor Module Terminal Overlap for Creepage Insulation
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Solution Overview
Problem
Conventional semiconductor modules face issues with electrical insulation between terminals due to separation of the insulating sheet from the resin sealing element, which can lead to insufficient creepage distance and increased module size.
Innovation Solution
The semiconductor module incorporates a design where the first and second connection terminals have conductor portions that overlap each other, with an insulating sheet having an insulating portion and a protruding portion forming an angle relative to the terminal portion, ensuring electrical insulation while minimizing module size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sufficient creepage distance is left between terminals to maintain electrical insulation, then electrical insulation is ensured, but the size of the semiconductor module increases
Solution Approach 1:
The insulating sheet is folded to create a three-dimensional structure where the insulating portion extends between the first and second connection terminals. This folding approach utilizes the vertical dimension to achieve sufficient creepage distance without increasing the planar footprint of the module, thereby maintaining electrical insulation while minimizing module size.
Solution Approach 2:
The insulating sheet is positioned and folded such that the insulating portion is nested within the space between the connection terminals and the sealing element. This nesting approach allows the insulating structure to occupy minimal space while still providing the required creepage distance for electrical insulation.
2Ease of manufacture
If the insulating sheet is made to separate from the resin sealing element, then manufacturing is simplified, but electrical insulation between terminals cannot be maintained
Solution Approach 1:
The insulating sheet is divided into distinct functional portions: an insulating portion that provides creepage distance between terminals, and sealing-contact portions that adhere to the sealing element. This segmentation allows the insulating portion to maintain electrical insulation independently of the sealing element, while still enabling simplified manufacturing through selective adhesion.
Solution Approach 2:
The insulating sheet acts as an intermediary structure that bridges the gap between the connection terminals and the sealing element. By folding the insulating sheet to create the insulating portion, it provides a stable electrical insulation path that is not dependent on the adhesion strength between the insulating sheet and the sealing element.
3Stability of the object's composition
If the insulating sheet adheres firmly to the resin sealing element, then structural stability is improved, but the creepage distance becomes insufficient when terminals are closely spaced
Solution Approach 1:
The insulating sheet is folded to create a vertical insulating portion that extends between the terminals. This three-dimensional configuration provides sufficient creepage distance in the vertical dimension without requiring increased horizontal spacing, thereby maintaining both structural stability through adhesion and adequate creepage distance for electrical insulation.
Data Source
AI summary
A semiconductor module includes first and second semiconductor chips including first and second main electrodes, respectively; first and second connection terminals electrically connected to the first and second main electrodes, respectively; and an insulating sheet. The first connection terminal includes a first conductor portion including a first peripheral edge and a first terminal portion extending from the first peripheral edge in plan view, and the second connection terminal includes a second conductor portion including a second peripheral edge. A part of the first conductor portion overlap a part of the second conductor portion in plan view. The insulating sheet includes an insulating portion layered between the first and second conductor portions, and a first protruding portion positioned between a tip portion of the first terminal portion and the second peripheral edge in plan view, the first protruding portion forming an angle relative to a surface of the first terminal portion.