Semiconductor Terminal Layout for Accurate Deterioration Detection
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Solution Overview
Problem
Existing methods for determining semiconductor device deterioration, such as monitoring temperature or applying reverse voltage, struggle to accurately assess deterioration due to variations in solder bonding and wire bonding caused by thermal stress, which are influenced by material, thickness, and bonding conditions.
Innovation Solution
A semiconductor device design with specific terminal configurations and wiring connections, including first and second input conductive plates, detection terminals, and detection wiring members, allows for precise measurement of potential differences between terminals to assess deterioration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If temperature monitoring or reverse voltage methods are used to determine deterioration, then the semiconductor device can be monitored for degradation, but the measurement precision is insufficient due to variations in solder bonding and wire bonding caused by thermal stress
Solution Approach 1:
The invention segments the measurement path by introducing a dedicated detection wiring member that creates a separate measurement circuit from the main current path. This segmentation isolates the potential difference measurement from the effects of solder and wire bonding variations, allowing accurate deterioration detection without interference from thermal stress effects on bonding materials.
Solution Approach 2:
The detection wiring member acts as an intermediary element that facilitates precise potential difference measurement between the input and output conductive plates. This intermediary measurement path bypasses the deteriorating bonding materials (solder and wires), providing a stable reference for determining semiconductor chip deterioration independent of bonding material variations.
2Measurement precision
If existing deterioration determination methods are used, then some level of monitoring is achieved, but it is difficult to accurately determine deterioration due to influences from material, thickness, and bonding conditions
Solution Approach 1:
The measurement function is segmented from the power transmission function by using separate wiring paths. The detection wiring member is specifically dedicated to measurement, while main current wiring members handle power transmission. This segmentation simplifies the overall system by assigning specific functions to specific components, making the deterioration determination more accurate without requiring complex multi-parameter measurements.
Solution Approach 2:
The conductive plates serve multiple functions: they act as both current transmission paths and measurement reference points. The input conductive plate receives both input current and detection signals, while the output conductive plate outputs both processed current and measurement signals. This multi-functionality reduces the need for additional dedicated components, simplifying the device structure while maintaining measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables accurate determination of semiconductor device deterioration by accounting for variations in solder and wire bonding, improving reliability and performance by identifying potential differences through inter-terminal measurements.
Implementation Method 1
deterioration is determined based on a leakage current that flows through the semiconductor chip
Implementation Method 2
a first detection wiring member which connects the front surface of the first output conductive plate to the first detection terminal
Data Source
AI summary
A semiconductor device includes a first input conductive plate on which a plurality of first semiconductor chips arranged in a first direction, a first output conductive plate extending in the first direction and being provided adjacent to the first input conductive plate, a case having first to fourth side walls for accommodating the first input conductive plate and the first output conductive plate, first main current wiring members, each of which connects one of the first output electrodes to a front surface of the first output conductive plate, a first detection terminal disposed in the first side wall, and a first detection wiring member connecting the front surface of the first output conductive plate to the first detection terminal. The first output conductive plate is disposed closer to the first side wall than is the first input conductive plate.