Semiconductor Terminal Double Structure for Flexible Module Design
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Solution Overview
Problem
Conventional intelligent power modules (IPMs) require significant design changes and increased manufacturing costs when specifications for control drive or protection operations need to be altered, as they house both power devices and control circuits within a single package.
Innovation Solution
A semiconductor device with a power device, sensor, main electrode terminal, sensor signal terminal, and driving terminal, where the sensor signal and driving terminals form a double structure, allowing for common usage of parts and reducing manufacturing costs by enabling easy module changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a power device, sensor unit, control circuit for drive, and control circuit for protection are housed in a single package, then the device provides integrated control and protection functions, but drastic design change is required when changing specifications for control drive or protection operation, causing increased manufacturing cost
Solution Approach 1:
The terminal structure is segmented into a first terminal and a second terminal that are electrically connected to form a double structure. This segmentation allows selective use of terminals based on module type, enabling specification changes without complete redesign. The first terminal can be used for sensor signal transmission while the second terminal can be used for drive control, and they are electrically connected to allow flexibility in configuration.
Solution Approach 2:
The terminal structure is designed with multi-functionality where the first and second terminals can serve different purposes depending on the module type. The same terminal structure can be used across different module configurations (IPM, IGBT module, MOS transistor module) by selectively using either the first or second terminal, reducing manufacturing cost through parts commonality while maintaining adaptability to different specifications.
2Adaptability or versatility
If the sensor signal terminal and driving terminal are positioned close to the case wall, then the package structure is compact, but design changes require complete redesign of the package layout
Solution Approach 1:
The terminal structure is divided into first and second terminals with specific spacing from the case wall. This segmentation creates a modular terminal arrangement that can be selectively used for different module types without requiring complete package redesign. The spaced positioning of terminals provides design flexibility while maintaining a relatively simple package structure.
Data Source
AI summary
A semiconductor device comprises a power device, a sensor which measures a physical state of the power device to transmit a signal according to the physical state, and a main electrode terminal through which a main current of the power device flows. The semiconductor device further comprises a sensor signal terminal connected to the sensor for receiving a signal from the sensor, a driving terminal which receives driving power for driving the power device, and an open bottomed case which houses the power device, the sensor, the main electrode terminal, the sensor signal terminal and the driving terminal. The first and second terminals electrically conduct with each other to form a double structure. Also, the sensor signal terminal and the driving terminal each have a first terminal and a second terminal which are not embedded within the case.