Semiconductor Module Terminal Layout to Block Epoxy Resin Adhesion
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Solution Overview
Problem
Conventional semiconductor modules face issues with epoxy resin adhesion to terminals handling high currents or voltages, leading to increased contact resistance and reduced efficiency in driving loads like motors.
Innovation Solution
A semiconductor module design with a case having a specific inner wall and peripheral edge structure, along with a sealing section of epoxy resin, where weld lines are formed to prevent epoxy resin adhesion to terminals by directing the resin flow away from these terminals during casting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy resin is used as sealing material to seal semiconductor chips, then sealing and protection are improved, but adhesion to high current/voltage terminals increases contact resistance
Solution Approach 1:
The patent divides the terminal structure into multiple parts: the terminal body, the fastening surface portion, and the protruding portion. This segmentation allows the epoxy resin to seal around the terminal without adhering to the fastening surface, maintaining electrical conductivity while providing sealing protection.
Solution Approach 2:
The protruding portion acts as an intermediary element between the terminal and the epoxy resin. It provides a surface for the epoxy to adhere to and flow around, preventing direct contact between the resin and the fastening surface, thus avoiding increased contact resistance.
2Reliability
If epoxy resin is cast to seal terminals, then sealing is improved, but resin droplets adhere to terminals causing heat generation
Solution Approach 1:
The fastening surface portion is designed to protrude from the terminal body before the epoxy resin is cast. This preliminary structural arrangement ensures that when the resin is injected, it flows around the protruding portion and cures without adhering to the fastening surface, preventing heat generation from adhesion.
3Reliability
If epoxy resin adheres to terminals, then sealing coverage is improved, but current flow and voltage application are reduced
Solution Approach 1:
The patent applies different properties to different parts of the terminal structure. The fastening surface portion has electrical conductivity and is designed to remain free of epoxy adhesion, while other parts of the terminal can be sealed. This local differentiation ensures proper current flow while maintaining sealing coverage.
Data Source
AI summary
There are provided a semiconductor module capable of preventing the adhesion of an epoxy resin to a terminal to which at least one of a high current and a high voltage is supplied and a method for manufacturing a semiconductor module. A semiconductor module includes: a case having an inner wall defining a casting region and a peripheral edge portion arranged outside the inner wall; an intermediate terminal arranged in along side portion of a peripheral edge portion and having a fastening surface to which a cable is fastened; a structure arranged in a long side portion of the inner wall to be adjacent to the long side portion where the intermediate terminal is arranged and higher than the fastening surface; and a sealing section formed of an epoxy resin, having weld lines formed close to the side of the structure on a surface, and cast into a casting region to seal transistors.