Semiconductor Module Terminal Layout for Smaller Footprint
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Solution Overview
Problem
There is a demand for energy-saving, sophisticated, and smaller electronic devices, which requires improved performance and reduced size of semiconductor modules.
Innovation Solution
A semiconductor module configuration featuring a conductive substrate with a semiconductor element having a switching function, a control terminal, and a sealing resin that covers the substrate and element, with the control terminal protruding to enhance performance and reduce size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional semiconductor module configuration is used, then basic functionality is maintained, but module size cannot be reduced further and performance improvement is limited
Solution Approach 1:
The control terminal is configured to extend in the thickness direction (vertical dimension) rather than only in the planar direction, utilizing the third dimension to reduce in-plane footprint while maintaining electrical connection functionality. This dimensional transition allows the module to achieve better performance with reduced overall size.
Solution Approach 2:
The control terminal is embedded within the sealing resin structure, with the terminal nested inside the resin body and only the tip protruding outward. This nesting approach integrates the control terminal into the existing module architecture, eliminating the need for separate external connections and reducing overall module size.
2Reliability
If control terminal is extended in planar direction, then electrical connection is ensured, but module footprint increases
Solution Approach 1:
The control terminal transitions from a planar extension to a vertical extension through the thickness direction of the sealing resin. This dimensional change maintains reliable electrical connection between the semiconductor element and external circuitry while dramatically reducing the in-plane footprint area.
Solution Approach 2:
The sealing resin acts as a flexible encapsulating structure that contains the control terminal within its thickness, allowing the terminal to extend vertically through the resin shell while keeping the overall module footprint compact. The resin shell provides both mechanical support and electrical insulation.
Data Source
AI summary
A semiconductor module includes a conductive substrate, a semiconductor element, a control terminal, and a sealing resin. The conductive substrate has an obverse surface and a reverse surface that are spaced apart from each other in a thickness direction. The semiconductor element is electrically bonded to the obverse surface and has a switching function. The control terminal is configured to control the semiconductor element. The sealing resin has a resin obverse surface and a resin reverse surface, and covers the conductive substrate, the semiconductor element, and a part of the control terminal. The control terminal protrudes from the resin obverse surface, and extends along the thickness direction.