Semiconductor Device Terminal Function Switching
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Solution Overview
Problem
Conventional semiconductor devices lack the ability to appropriately switch between terminals functioning as power supply and output terminals, limiting their usage flexibility.
Innovation Solution
A semiconductor device design featuring multiple conductor portions with integrated terminals and electronic elements, where the connection aspect can be altered to select the usage mode of the terminals, allowing the first terminal to function as a power supply or output terminal based on the second terminal's role.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a predetermined terminal functions as a power supply terminal and another terminal functions as an output terminal, then the terminal functions are fixed and stable, but the device lacks flexibility to change terminal roles
Solution Approach 1:
The patent makes the terminal functions dynamic by allowing the first and second terminals to switch roles between power supply and output functions. The conductor portions are designed to be connectable in different configurations, enabling the device to adapt its terminal functions based on connection aspects rather than being fixed statically.
Solution Approach 2:
The first terminal and second terminal are designed to serve multiple functions - each can function as either a power supply terminal or an output terminal depending on the connection configuration. This multi-functionality allows the same physical terminals to adapt to different operational requirements without adding additional terminal structures.
2Temperature
If the back surfaces of conductor portions are exposed from the sealing portion, then heat radiation is improved, but the device structure becomes more complex
Solution Approach 1:
The sealing portion is designed to selectively cover only the upper surfaces of the conductor portions while leaving the back surfaces exposed. This local differentiation allows the back surfaces to serve as heat radiation surfaces while the covered upper surfaces provide electrical insulation and protection, optimizing both thermal and electrical performance.
Data Source
AI summary
A semiconductor device comprises a plurality of first conductor portions 10, a plurality of second conductor portions 20 and a sealing portion 50, covering upper surfaces of the first conductor portion 10 and the second conductor portion 20. The first conductor portion 10 and the second conductor portion 20 are connected. Usage mode of the first terminal 11 and the second terminal 12 can be selected, and the second terminal 21 of the second conductor portion 20 serves as an output terminal in a case where the first terminal 11 of the first conductor portion 10 is used as a power supply terminal, and the first terminal 11 of the first conductor portion 10 serves as an output terminal in a case where the second terminal 21 is used as a power supply terminal.