Semiconductor Package Terminal Guide Hole for Burr-Free Pin Insertion
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Solution Overview
Problem
Conventional semiconductor packages face issues with terminal pin insertion due to the formation of steps between the resin guide portion and the plate-shaped terminal, leading to potential short-circuit defects from metal shavings and burrs.
Innovation Solution
The design features a resin molded product with a flat plate-shaped terminal and a resin guide portion having through-holes with tapered shapes, ensuring that the sidewalls of the guide portion and the terminal align seamlessly, eliminating the step formation and preventing terminal pin shaving.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a resin guide portion with a through-hole is provided to guide the terminal pin, then the terminal pin insertion is facilitated, but steps are formed between the resin guide portion and the plate-shaped terminal which cause metal shavings and burrs
Solution Approach 1:
The through-hole in the plate-shaped terminal is changed from a cylindrical shape to a tapered shape, with the hole diameter gradually decreasing from the insertion side toward the opposite side. This parameter change allows the terminal pin to be guided smoothly without forming steps, eliminating the generation of metal shavings and burrs while maintaining easy insertion
Solution Approach 2:
The resin guide portion is designed with a through-hole that has different diameter characteristics at different locations - wider at the insertion side and narrower at the opposite side. This local quality variation creates a tapered guiding surface that facilitates insertion while preventing step formation and metal shaving
2Ease of manufacture
If the through-hole width is uniform between both surfaces of the plate-shaped terminal, then the manufacturing is simplified, but steps are formed at the boundary between the resin guide portion and terminal which lead to short-circuit defects
Solution Approach 1:
The through-hole geometry is changed from uniform width to tapered width, with the diameter gradually decreasing from the insertion side to the opposite side. This parameter modification eliminates step formation at the boundary between the resin guide portion and terminal, preventing short-circuit defects while remaining manufacturable
Data Source
AI summary
A semiconductor package includes a flat plate-shaped terminal integrally formed with a housing portion for a semiconductor chip and a rod-shaped terminal pin that penetrates through a through-hole of the plate-shaped terminal. On a surface of the plate-shaped terminal, a resin guide portion for guiding the terminal pin to the through-hole of the plate-shaped terminal is provided. The resin guide portion is a portion of the housing portion and has a through-hole that is continuous with the through-hole of the plate-shaped terminal. During assembly of the semiconductor package, the terminal pin is inserted into the through-hole of the plate-shaped terminal, via the through-hole of the resin guide portion. A sidewall of the through-hole of the resin guide portion and a sidewall of the through-hole of the plate-shaped terminal have a same slope and form a single continuous surface; a border between the through-hole of the resin guide portion and the through-hole of the plate-shaped terminal is free of any step.