Semiconductor Terminal Structure With Thicker Outer Lead for Heat Dissipation
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Solution Overview
Problem
Existing semiconductor manufacturing apparatuses face limitations in reducing terminal temperature due to restrictions on terminal thickness, which hinders effective heat management during current flow.
Innovation Solution
The apparatus employs a design where the second terminal, outside the sealing material, has a greater thickness than the first terminal, allowing for increased heat radiation and efficient heat management by adjusting the cross-sectional area of the terminals, and using materials like copper and laser welding for joining.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the width of the terminal is changed to suppress temperature, then the terminal temperature is reduced, but the terminal thickness is restricted and cannot be optimized
Solution Approach 1:
The invention changes the geometric parameters of the terminal by making the second terminal thicker than the first terminal in the thickness direction. This parameter change allows the terminal to have greater heat radiation area without increasing the width, thereby suppressing terminal temperature while maintaining design flexibility in the thickness direction.
Solution Approach 2:
The invention transitions from optimizing terminal dimensions only in the width direction to utilizing the thickness direction for heat radiation optimization. By increasing the thickness of the second terminal, the invention creates additional thermal management capability in a new dimension, allowing temperature suppression without width increases.
2Temperature
If the terminal thickness is increased to enhance heat radiation, then the heat radiation area is increased, but the terminal structure becomes more complex
Solution Approach 1:
The invention divides the terminal structure into two distinct segments: the first terminal with a certain thickness and the second terminal with a greater thickness. This segmentation allows each terminal to have optimized dimensions for its specific function, with the second terminal providing enhanced heat radiation capability without requiring the entire terminal structure to be complex.
Solution Approach 2:
The invention applies different thickness qualities to different parts of the terminal structure. The second terminal has a greater thickness specifically at the portion extending from the sealing material to provide localized heat radiation enhancement, while other portions maintain appropriate thickness for their functions, avoiding unnecessary overall structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses temperature rise by enhancing heat radiation and reducing thermal resistance, improving the efficiency and reliability of the semiconductor manufacturing apparatus.
Implementation Method 1
allowing for increased heat radiation and efficient heat management by adjusting the cross-sectional area of the terminals
Implementation Method 2
reducing thermal resistance
Data Source
AI summary
A semiconductor manufacturing apparatus of the present disclosure includes a semiconductor module having a semiconductor device, a sealing material adapted to seal the semiconductor module, and a second terminal to be arranged outside the sealing material. The semiconductor module includes a first terminal electrically connected to the semiconductor device and extending to the outside of the sealing material. The first terminal is joined to the second terminal outside the sealing material. The thickness of the second terminal in a direction perpendicular to a joined face of the first terminal and the second terminal is defined as the thickness of the second terminal. The thickness of the first terminal at a portion extending from the sealing material in the direction perpendicular to the joined face is defined as the thickness of the first terminal. The thickness of the second terminal is greater than the thickness of the first terminal.