Semiconductor Module Terminal Layout for Laser-Weld Heat Isolation
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Solution Overview
Problem
In semiconductor modules with laminated terminal structures, the insulating layer is subjected to thermal stress and its insulating performance is compromised during laser welding, leading to reduced withstand voltage due to the inability to place a protective member on the opposite side of the laser beam.
Innovation Solution
A semiconductor module design featuring a first external connection terminal with a non-contact portion that prevents direct heat transfer to the insulating layer, utilizing a groove or recess to create an air layer that blocks heat from the molten portion during laser welding, thereby maintaining the insulating layer's integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If laser welding is used to join connecting members and terminals, then the connection strength and electrical conductivity are improved, but the insulating layer is subjected to thermal stress and its insulating performance deteriorates
Solution Approach 1:
The external connection terminal is divided into a contact portion (in contact with insulating layer) and a non-contact portion (not in contact with insulating layer). The non-contact portion acts as a heat barrier, segmenting the heat transfer path during laser welding to protect the insulating layer while maintaining connection strength.
Solution Approach 2:
The non-contact portion of the external connection terminal serves as an intermediary heat barrier between the laser welding zone and the insulating layer. It intercepts and blocks thermal energy, preventing direct heat transfer to the insulating layer and maintaining its electrical insulation properties.
2Reliability
If a protective member is added to prevent heat damage to the insulating layer, then the insulating performance is maintained, but the device complexity increases
Solution Approach 1:
The external connection terminal performs multiple functions: it provides electrical connection, structural support, and thermal protection. The non-contact portion specifically blocks heat while the contact portion maintains electrical contact with the insulating layer, eliminating the need for separate protective members.
Solution Approach 2:
The external connection terminal protects itself and the insulating layer by incorporating a non-contact portion that automatically blocks heat during laser welding. The structure serves its own protective function without requiring additional components or complex assembly procedures.
3Productivity
If the insulating layer is made thinner to reduce module size, then the productivity and compactness are improved, but the withstand voltage decreases due to thermal damage during laser welding
Solution Approach 1:
The non-contact portion is designed in advance as a heat barrier to cushion and block thermal energy before it can reach the insulating layer. This preemptive protection allows the use of thinner insulating layers without compromising withstand voltage, as the heat barrier prevents thermal damage during welding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses thermal damage to the insulating layer, ensuring the original insulating performance and withstand voltage are maintained, even with a low heat-resistant insulating material, by blocking heat transfer from the molten portion during laser welding.
Implementation Method 1
the heat of the molten portion is blocked by the non-contact portion and is not directly transmitted to the insulating layer
Implementation Method 2
the first external connection terminal and the second terminal of the capacitor are electrically connected by laser welding via a laser welded portion
Data Source
AI summary
A semiconductor module includes a resin case housing a semiconductor element; an insulating layer extending outward from the resin case; and a first external connection terminal extending outward from the resin case, arranged above the insulating layer so as to face the insulting layer, the first external connection terminal having a non-contact portion that is not in contact with the insulating layer in a thickness direction of the insulating layer at a position overlapping the insulating layer in a plan view.