Semiconductor Terminal Structure With Recessed Holder for PCB Mounting
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Solution Overview
Problem
Conventional semiconductor devices face challenges in achieving energy-saving, high-performance, and miniaturization, particularly in semiconductor modules used in electronic equipment.
Innovation Solution
A semiconductor device configuration featuring a cylindrical holder with a metal pin protruding beyond a sealing resin surface, combined with a support substrate and terminal structure, enhances performance and reduces size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the holder is made with a flat upper surface aligned with the resin obverse surface, then the molding process is simple, but the semiconductor device cannot be mounted on a circuit board
Solution Approach 1:
The holder is designed with an asymmetric structure where the upper surface is recessed relative to the resin obverse surface, creating a stepped configuration. This asymmetric design allows the semiconductor device to be mounted on a circuit board while maintaining simple molding processes, as the recessed portion can be formed with standard molding techniques.
Solution Approach 2:
The invention introduces a vertical dimension offset between the holder upper surface and the resin obverse surface. By recessing the holder's upper surface below the resin level, the design enables circuit board mounting functionality without complicating the horizontal molding process, effectively solving the contradiction through dimensional separation.
2Adaptability or versatility
If the holder upper surface is recessed to enable circuit board mounting, then mountability is improved, but the molding process becomes more complex
Solution Approach 1:
The holder structure is segmented into distinct levels: a lower portion that interfaces with the circuit board and an upper portion that is recessed below the resin obverse surface. This segmentation allows the molding process to be broken down into manageable stages, reducing overall complexity while achieving mountability.
Solution Approach 2:
The holder is pre-formed with the recessed upper surface configuration before final assembly. This preliminary action of creating the stepped structure during molding prepares the device for circuit board mounting without requiring additional complex post-processing steps, thereby managing molding complexity effectively.
3Adaptability or versatility
If the holder is designed with a recessed upper surface, then the device can be mounted on a circuit board, but the structural complexity increases
Solution Approach 1:
The holder structure merges the mounting function and the support function into a single integrated component. The recessed upper surface and the lower mounting portion are combined in one piece, eliminating the need for separate mounting brackets or additional structural elements, thus reducing overall device complexity while enabling circuit board mounting.
Data Source
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AI summary
A semiconductor device includes at least one terminal, and the terminal includes a cylindrical holder having electrical conductivity and a metal pin inserted in the holder. The semiconductor device further includes a terminal support supporting the holder, and a sealing resin covering a part of the holder and covering the terminal support. The sealing resin includes a resin obverse surface facing a first side in a thickness direction. The holder includes a first surface located at one end on the first side in the thickness direction and a first outer side surface extending in the thickness direction. The first surface is located at a position different from the resin obverse surface in the thickness direction. The first outer side surface is in contact with the sealing resin. The metal pin protrudes beyond the resin obverse surface toward the first side in the thickness direction.