Semiconductor Terminal Layout for Low-Crosstalk Inspection Access
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor apparatuses with many functions face challenges in miniaturization due to increased terminal numbers, leading to electric crosstalk and reduced inspection reliability, as additional inspection terminals are often located in prohibited areas, increasing wiring length and limiting information acquisition.
Innovation Solution
A semiconductor apparatus design featuring a terminal mounting surface with strategically arranged inspection terminals, memory operation terminals, and high-speed communication terminals, where inspection terminals are positioned to minimize crosstalk and optimize mounting area usage, including a first side, second side, third side, and fourth side configuration with inspection terminals located closest to the first side and second side intersections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of terminals is increased to support many functions, then the functionality and versatility of the semiconductor apparatus is improved, but the mounting area expands and terminals must be arranged at narrower pitch
Solution Approach 1:
The patent utilizes the fourth side of the substrate as an additional dimension for terminal arrangement. By placing inspection terminals on the fourth side (which faces the third side and is perpendicular to the first and second sides), the design expands the terminal layout into a new spatial dimension, effectively increasing terminal capacity without expanding the overall mounting area footprint.
2Area of stationary object
If terminals are arranged at narrow pitch to reduce mounting area, then the mounting area is reduced, but electric crosstalk between terminals increases
Solution Approach 1:
The patent applies local quality by assigning specific functional characteristics to different terminal groups. Inspection terminals are positioned on the fourth side away from the main signal terminal rows, creating a localized region with different electrical characteristics. This spatial separation provides inherent electrical isolation, reducing crosstalk while maintaining narrow pitch arrangements for signal terminals where high-density connection is critical.
3Area of stationary object
If additional inspection terminals are placed in prohibited areas at end portions of substrate, then mounting area usage is optimized, but wiring length increases and inspection reliability decreases
Solution Approach 1:
Instead of placing inspection terminals in the conventional prohibited area at the end portion of the substrate, the patent inverts the approach by positioning them on the fourth side, which is a previously underutilized boundary. This inverted placement strategy transforms a non-functional boundary into a valuable location for inspection terminals, simultaneously optimizing mounting area usage and maintaining short wiring lengths to internal circuits.
4Object-affected harmful factors
If inspection terminals are located far from internal circuits to avoid crosstalk, then electric crosstalk is reduced, but wiring length increases and inspection information quality is limited
Solution Approach 1:
The patent introduces the fourth side of the substrate as an intermediary spatial zone between the main signal terminal areas and the internal circuits. Inspection terminals positioned on this fourth side serve as intermediaries that can access inspection functions while maintaining adequate electrical isolation from high-speed signal terminals, thus reducing crosstalk while preserving inspection information quality through controlled signal paths.
Data Source
AI summary
There is provided a semiconductor apparatus including: a memory operation terminal for inputting a first signal; a high-speed communication terminal for inputting a second signal to a high-speed communication controller; an inspection terminal for performing debugging; and a terminal mounting surface at which a plurality of coupling terminals including the memory operation terminal, the high-speed communication terminal, and the inspection terminal are provided, in which the terminal mounting surface includes a first side, a second side, a third side, and a fourth side, the plurality of coupling terminals include a first terminal row located adjacent to the third side and arranged from the first side toward the second side; the first terminal row includes a first inspection terminal among the plurality of inspection terminals, and the first inspection terminal is located closest to the first side in the first terminal row.