Semiconductor Module Terminal Layout for Insulation and Heat Dissipation
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Solution Overview
Problem
Conventional power semiconductor modules face challenges in achieving effective heat dissipation from lead terminals while maintaining adequate insulation between the cooler and the lead terminals.
Innovation Solution
The semiconductor module design includes a recessed portion on the side face of the main body to accommodate an insulating member, allowing the main current terminal to protrude and maintain insulation with the cooler, while also enabling heat dissipation from the terminal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lead terminals are coated with resin to ensure insulation, then insulation distance between cooler and lead terminals is improved, but heat dissipation from lead terminal surface deteriorates
Solution Approach 1:
The lead terminal is divided into two functional zones: the lower portion (second face) is coated with resin for insulation, while the upper portion (first face) remains exposed for heat dissipation. This segmentation allows each zone to fulfill its specific function without compromising the other.
Solution Approach 2:
Different portions of the lead terminal are given different properties: the lower portion has insulating properties (resin coating) while the upper portion has thermal radiation properties (exposed metal surface). This local differentiation optimizes both insulation and heat dissipation performance.
2Adaptability or versatility
If lead terminals protrude from side face for connectivity, then electrical connection capability is improved, but insulation distance from cooler deteriorates
Solution Approach 1:
The insulation solution moves from a horizontal approach (coating the entire terminal) to a vertical approach (positioning insulating member at the bottom face). The insulating member is placed in the vertical dimension between the cooler and the terminal, allowing the terminal to protrude horizontally for connectivity while maintaining vertical insulation distance.
Solution Approach 2:
An insulating member (resin layer) is introduced as an intermediary substance between the cooler and the lead terminal. This intermediary ensures electrical insulation while allowing both components to maintain their respective positions and functions.
3Reliability
If insulating member is placed between cooler and terminal, then insulation is improved, but device complexity increases
Solution Approach 1:
The insulating member is merged with the molding resin that forms the main body housing. The insulating resin layer is integrated into the existing molding process, combining the insulation function with the structural housing function, thereby avoiding additional separate components.
Solution Approach 2:
The molding resin serves multiple functions: it provides the main body structure, encapsulates the semiconductor elements, and creates the insulating layer between the cooler and lead terminals. This multi-functionality reduces the need for separate insulating components.
Data Source
AI summary
A semiconductor module includes: a first power semiconductor element that includes a first main current electrode; a main body that accommodates therein the first power semiconductor element; and a first main current terminal connectable to the first main current electrode. The main body includes: a top face; a side face that connects to the top face; a bottom face fixable to a cooler; and a recessed portion that is on the side face, and accommodates therein an end portion of an insulating member. The first main current terminal protrudes from the side face of the main body, and includes: a first face; and a second face on an opposite side of the first face. The second face is closer to the bottom face than the first face on the side face. The recessed portion is on the side face between the bottom face and the second face, and is at a position apart from the bottom face.