Semiconductor Module Terminal Insulation for Molding Stability
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Solution Overview
Problem
Semiconductor modules with insulating members having protruding portions between positive and negative terminals often deform during integral molding, leading to insufficient insulation distance and reduced insulation performance, especially when using thin materials like insulating paper.
Innovation Solution
The semiconductor module design includes a terminal structure with a protruding insulating member sandwiched between positive and negative terminals, which is further secured by second and third insulating members covering the front and rear surfaces of the protruding portions, preventing deformation and improving insulation performance during molding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the insulating member is made wider than the terminals to provide sufficient insulation distance, then insulation performance is improved, but the protruding portion deforms during integral molding
Solution Approach 1:
The insulating member is positioned and fixed in advance before the integral molding process. By preliminarily securing the insulating member between the terminals and to the mold, the invention prevents deformation during molding while maintaining the necessary insulation distance. This preliminary positioning action ensures that the protruding portion retains its intended shape and dimensional accuracy throughout the molding process.
2Productivity
If thin insulating material like insulating paper is used, then the inductance is reduced, but the insulating material is more likely to deform during molding
Solution Approach 1:
The invention employs thin insulating material (such as insulating paper) as a flexible film that provides adequate insulation while minimizing inductance. The thin film is strategically positioned between terminals and secured to the mold, allowing it to maintain its insulating function without the excessive thickness that would increase inductance. The fixed positioning prevents deformation despite the material's thinness.
Solution Approach 2:
The thin insulating material is preliminarily positioned and fixed between the terminals before the integral molding process begins. This preliminary action ensures that even though the material is thin and susceptible to deformation, it maintains its structural integrity and insulation distance throughout molding by being secured in advance to the mold structure.
3Productivity
If the terminal structure with protruding insulating member is integrally molded with the case, then manufacturing efficiency is improved, but fixing the terminal structure to the mold becomes time-consuming
Solution Approach 1:
The invention merges the terminal structure with the mold itself by fixing the terminal structure directly to the mold during integral molding. This integration eliminates the need for separate molding operations and reduces the time required for fixing, as the terminal structure becomes part of the molding process rather than a separate component requiring post-assembly. The insulating member is positioned and fixed in advance, allowing the entire assembly to be molded as one piece, thereby improving manufacturing efficiency while minimizing additional time requirements.
Data Source
AI summary
A semiconductor module, including: a semiconductor unit including first and second switching elements; a terminal structure including: a positive terminal electrically connected to a positive electrode of the first switching element, a negative terminal electrically connected to a negative electrode of the second switching element, a first insulating member sandwiched between the positive terminal and the negative terminal, and includes a protruding portion where a part of the first insulating member protrudes from between the positive terminal and the negative terminal, and second and third insulating members sandwiching the terminal structure and covering front and rear surfaces of at least a part of the protruding portion; and a case that is integrally molded with the terminal structure, and that houses the semiconductor unit.