Semiconductor Module Terminal Joining for Displacement Resistance
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Solution Overview
Problem
Semiconductor modules with protruding connection terminals are prone to displacement and detachment due to external forces, such as those from wiring substrates, leading to reliability issues.
Innovation Solution
A semiconductor module design featuring a tubular support conductor and connection terminal with a conductive joining part between the inner wall of the support conductor and the outer wall of the connection terminal, where the first end of the connection terminal is press-fitted into the support conductor, and the second end protrudes from a housing part, enhancing mechanical stability and reducing the likelihood of displacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection terminals are simply inserted into support conductors without additional joining measures, then the device complexity is reduced and manufacturing is easier, but the connection terminals are prone to displacement and detachment under external forces
Solution Approach 1:
The connection terminal is press-fitted into the support conductor before final assembly, creating preliminary mechanical engagement. This preliminary action ensures proper positioning and prevents displacement during subsequent assembly steps and operation, resolving the contradiction by establishing stability before the device is fully assembled.
Solution Approach 2:
A joining material is introduced as an intermediary substance between the connection terminal and support conductor. This joining material fills the annular space and creates a bonded connection, mediating the interface between the two components to prevent detachment while maintaining a relatively simple overall structure.
2Reliability
If connection terminals are press-fitted into support conductors, then mechanical stability is improved, but the manufacturing process becomes more complex and time-consuming
Solution Approach 1:
The press-fitting operation is merged with the assembly process itself, allowing the connection terminal to be inserted and mechanically engaged in a single continuous operation. This combining of functions reduces the number of separate manufacturing steps while maintaining the stability benefits of press-fitting.
Solution Approach 2:
The connection terminal's own structural features (such as its shape and dimensions) enable it to be self-positioned and self-secured within the support conductor through the press-fitting action. This self-service characteristic reduces the need for additional complex manufacturing equipment or multi-step processes, maintaining productivity while achieving reliability.
3Reliability
If joining material is used to bond connection terminals to support conductors, then displacement is prevented, but the manufacturing process and material requirements become more complex
Solution Approach 1:
The physical and chemical parameters of the joining material are optimized to achieve reliable bonding at relatively low temperatures and with simple application methods. By adjusting parameters such as viscosity, curing temperature, and bonding strength, the joining process becomes more straightforward while maintaining connection stability.
Solution Approach 2:
The joining material is formulated as a composite substance combining adhesive properties with electrical conductivity requirements. This composite material simultaneously provides mechanical bonding to prevent displacement and maintains electrical connectivity, eliminating the need for separate bonding and conductive layers, thus simplifying the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses the displacement and detachment of connection terminals, ensuring reliable electrical connectivity and durability under external forces, with the joining material's properties optimized to maintain integrity within operational temperature ranges.
Implementation Method 1
a conductive first joining part located between an inner wall surface of the support conductor and an outer wall surface of the connection terminal, and configured to join between the support conductor and the connection terminal
Data Source
AI summary
A semiconductor module includes: a mounting board; a semiconductor chip mounted on the mounting board; a tubular support conductor mounted on the mounting board; a housing part that accommodates the mounting board, the semiconductor chip, and the support conductor; a connection terminal electrically connected to the semiconductor chip, the connection terminal including a first end portion press-fitted into the support conductor and a second end portion protruding from the housing part; and a conductive first joining part located between an inner wall surface of the support conductor and an outer wall surface of the connection terminal, and configured to join between the support conductor and the connection terminal.