Semiconductor Terminal Assembly Laser Welding Insulation
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Solution Overview
Problem
Existing semiconductor devices face challenges in reducing the size of the case while maintaining joint strength and insulation between external connection terminals, as the need for spaced wiring terminal plates increases the device size and exposes connections to potential deterioration.
Innovation Solution
A semiconductor device design where wiring terminal plates are led out of the case, assembled into a terminal assembly portion, and connected to external connection terminal plates using laser welding, with a mold resin used to insulate and protect the connections, allowing for reduced external dimensions and enhanced joint strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wiring terminal plates are spaced apart to maintain insulation, then electrical isolation is ensured, but the case size increases
Solution Approach 1:
The patent transitions from planar spacing to three-dimensional arrangement by leading wiring terminal plates vertically out of the circuit formation region and assembling them in a terminal assembly portion. This vertical dimension allows terminal plates to be positioned close together horizontally while maintaining electrical insulation through vertical separation and mold resin encapsulation, thereby reducing case size without compromising insulation reliability.
2Ease of operation
If wiring terminal plates are led out of the case, then connection accessibility is improved, but joint strength may deteriorate
Solution Approach 1:
The patent introduces a terminal assembly portion as an intermediary structure that receives and secures the wiring terminal plates led out from the circuit formation region. This assembly portion provides mechanical support and reinforcement to the terminal plates, ensuring joint strength while allowing them to extend outward for accessible connections to external terminals.
3Volume of stationary object
If terminal assembly portion is compact, then device size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs preliminary action by pre-assembling the wiring terminal plates in the terminal assembly portion before final encapsulation with mold resin. The wiring terminal plates are positioned and secured in their precise locations in advance, allowing for controlled assembly operations. This preliminary arrangement ensures accurate positioning and reduces the complexity of achieving high precision in the final compact configuration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design secures joint strength and withstands voltage while reducing the external dimensions of the semiconductor device, maintaining insulation and mechanical strength through the use of mold resin and efficient laser welding.
Implementation Method 1
external connection terminal plates are connected to the wiring terminal plates and external terminals by a laser welding
Data Source
AI summary
Terminal assembly portions, lying on a front surface side of a case, are aligned in a left-right direction in a portion raised from a bottom of the case so that opening faces of the terminal assembly portions are positioned above circuit formation regions. Wiring terminal plates are led out into the terminal assembly portions, and disposed adjacent to each other. After each wiring terminal plate is connected by a laser welding to one end of one external connection terminal plate formed integrally with a cover, these welded portions are sealed with a second mold resin portion made of gel or an insulating resin such as epoxy. By so doing, even when the terminal junction area and distance between terminal junctions in the terminal assembly portions are small, it is possible to increase the joint strength of the terminals, and also secure withstand voltage.