Semiconductor Module Terminal Layout for Low-Inductance Power Conversion
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Solution Overview
Problem
Existing power conversion devices face challenges in reducing the inductance of wiring connections between semiconductor elements and smoothing capacitors due to the configuration of bent terminals, making it difficult to minimize the distance between them.
Innovation Solution
The power conversion device incorporates a second cooler that is shorter than the first cooler, with bent terminals having extension portions that face the second cooler, allowing the smoothing capacitor to be positioned closer to the semiconductor module without interference, thereby reducing the inductance of the wiring.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If bent terminals are used to connect smoothing capacitors, then electrical connection is achieved, but the distance between terminals and capacitors cannot be minimized due to terminal configuration
Solution Approach 1:
The terminal structure transitions from a planar configuration to a three-dimensional configuration by adding a bent portion that extends in the stacking direction. This dimensional change allows the terminal to reach the capacitor positioned on the opposite side of the semiconductor module, minimizing the distance between connection points while maintaining electrical connectivity.
2Loss of energy
If smoothing capacitor is positioned far from semiconductor module, then wiring inductance increases, but positioning it close causes interference with terminal arrangement
Solution Approach 1:
The terminal structure is divided into multiple functional segments: a first extension portion for lateral connection, a bent portion for vertical extension toward the capacitor, and a second extension portion for final connection. This segmentation allows each portion to optimize its function, enabling the capacitor to be positioned close to the semiconductor module without interfering with terminal arrangement.
3Temperature
If second cooler is made longer, then cooling coverage increases, but it interferes with positioning capacitor close to semiconductor module
Solution Approach 1:
The first cooler and second cooler are designed with asymmetric lengths in the stacking direction. The first cooler extends further to provide comprehensive cooling coverage, while the second cooler is shorter to avoid interfering with the capacitor positioning. This asymmetric design allows both cooling effectiveness and compact capacitor placement to be achieved simultaneously.
Data Source
AI summary
A power conversion device includes a first cooler, a semiconductor module, and a second cooler. In Z direction, the first cooler, the semiconductor module, and the second cooler are stacked in this order. The external connection terminals of the semiconductor module include a main terminal electrically connected to a capacitor and a signal terminal which is a bent terminal. The signal terminal has a first extension portion extending on the same side as the main terminal, and a second extension portion bent relative to the first extension portion, extending in the Z direction, and facing the second cooler in Y direction. In the Y direction, a length of the second cooler is shorter than a length of the first cooler. In the Y direction, a distance between the second extension portion and the second cooler is shorter than a distance between the second extension portion and the first cooler.