Semiconductor Terminal Layout for Low-Inductance Compact Packaging
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Solution Overview
Problem
Conventional semiconductor devices face issues with increased main circuit inductance, leading to surge voltage generation and a larger device size due to wide main terminals connected to the substrate, which complicates the structure and hinders high voltage and heat resistance.
Innovation Solution
The semiconductor device features first and second main terminals with narrower portions connected to the substrate, where the center of these narrow portions is positioned closer to the opposing terminal, reducing inductance and allowing for a more compact design by optimizing terminal geometry and placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If main terminals are made wider to connect to external conductors, then connection reliability is improved, but device size increases and inductance increases
Solution Approach 1:
The main terminal is divided into two distinct portions: a wide external connection portion for reliable external conductor connection, and a narrow portion for substrate connection. This segmentation allows each portion to be optimized independently - the external connection portion maintains wide width for reliability while the narrow portion reduces width to minimize device size and inductance.
Solution Approach 2:
Different portions of the main terminal have different width characteristics tailored to their specific functions. The external connection portion has large width for mechanical strength and connection reliability, while the portion connected to the substrate has small width to reduce inductance and device footprint. This local quality differentiation resolves the contradiction between connection reliability and device size.
2Stability of the object's composition
If main terminals are made wider to ensure connection stability, then connection stability is improved, but main circuit inductance increases
Solution Approach 1:
The terminal structure is segmented into a stable wide external connection portion and a narrow substrate connection portion. The wide external connection portion ensures connection stability while the narrow portion minimizes the loop area and thus reduces main circuit inductance, resolving the contradiction between stability and inductance.
Solution Approach 2:
The terminal exhibits local quality variation where the external connection portion has large width for stability while the substrate connection portion has small width to reduce inductance. This spatial differentiation of width characteristics allows simultaneous achievement of connection stability and low inductance.
3Temperature
If main terminals are positioned farther from the substrate to improve cooling, then heat dissipation is improved, but device size increases
Solution Approach 1:
The narrow width of the substrate-connected portion allows for optimized thermal management by reducing the thermal path length while maintaining compact device dimensions. The localized narrow design enables better heat dissipation efficiency without proportionally increasing overall device volume.
Data Source
AI summary
A semiconductor device includes a substrate with one side and another side in a first direction parallel to a surface thereof and including a semiconductor element provided thereon, and first and second main terminals located at the one side of the substrate, side by side a second direction parallel to the surface of the substrate and orthogonal to the first direction. The first and second main terminals respectively include first and second external connection portions respectively connected to separate external conductors, and respectively include first and second narrow portions connected to the substrate. In the second direction, widths of the first and second narrow portions are respectively less than widths of the first and second external connection portions. Centers of the first and second narrow portions are located closer respectively to the second and first main terminals than are centers of the first and second external connection portions.