Semiconductor Device Terminal Layout for Motor Drive Inverters
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Solution Overview
Problem
Conventional semiconductor devices for motor drive inverter applications face challenges in downsizing due to complex internal connections and handling of multiple terminals, which complicates the management of large current and high voltage operations.
Innovation Solution
The semiconductor device features a frame with external terminals and substrates having conductive layers, where semiconductor elements are mounted with main and control electrodes, and bonding wires or control wiring substrates establish connections between these elements and terminals, allowing for a simplified internal structure and reduced size through orthogonal placement of conductive plates and bonding wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple terminals and complex internal connections are provided for P-side and N-side power source terminals, output terminals, and control terminals, then the device can handle large current and high voltage operations, but the device size increases and becomes difficult to downsize
Solution Approach 1:
The patent applies dimensional reorganization by arranging control terminals and power terminals in different spatial dimensions and orientations. Control terminals are positioned above wires in a vertical arrangement, while power terminals are arranged horizontally at side portions of the frame. This multi-dimensional layout allows independent routing of control and power paths, reducing interference and enabling compact integration without compromising high voltage and large current handling capability.
Solution Approach 2:
The patent segments the terminal connections into distinct functional groups: control terminal connecting portions that establish connections above wires, and power terminal connecting portions that establish connections at side portions. This segmentation allows independent optimization of control signal paths and power current paths, enabling downsizing while maintaining reliable handling of large currents and high voltages through separated routing paths.
2Adaptability or versatility
If complex internal connections are provided for multiple terminals, then the device can perform switching operations with control, but the handling of internal connections becomes complicated
Solution Approach 1:
The patent simplifies internal connection handling by utilizing vertical space above wires for control terminal connections. Control terminals are positioned in the vertical dimension above the horizontal wire layout, creating a layered connection structure. This dimensional separation makes the routing and handling of control connections more straightforward while maintaining full switching control capability.
Solution Approach 2:
The patent introduces wire structures as intermediary elements that facilitate simplified connections. Control terminals connect to control electrodes through bonding wires that run above the wire structures, while power terminals connect through terminal connecting portions at the frame sides. These intermediary wire structures act as mediators that simplify the overall connection topology while preserving adaptability for switching operations.
3Reliability
If control terminals and power terminals are arranged in a conventional manner, then connections can be established, but crosstalk between current and control signal paths occurs
Solution Approach 1:
The patent effectively eliminates crosstalk by arranging control terminals and power terminals in orthogonal spatial dimensions. Control terminals are positioned vertically above wires, while power terminals are arranged horizontally at side portions of the frame. This orthogonal arrangement creates physically separated electromagnetic fields, preventing crosstalk between control signals and power currents while maintaining stable connections through the frame structure.
Solution Approach 2:
The patent segments the electromagnetic space into distinct control signal regions and power current regions through separated terminal arrangements. Control terminal connecting portions are positioned above wires in one spatial zone, while power terminal connecting portions are positioned at side portions in another spatial zone. This spatial segmentation isolates the electromagnetic fields, eliminating crosstalk while preserving connection stability through dedicated routing paths for each function.
Data Source
AI summary
A semiconductor device includes: a frame; a first-external-terminal provided to a first side portion of the frame; a first substrate enclosed in the frame and having a first-conductive-layer at an upper surface; a first-semiconductor-element: mounted on the first-conductive-layer; having, on a lower surface, a first main electrode connecting with the first-conductive-layer; and having a second main electrode and a control electrode on an upper surface; a first terminal connecting portion establishing a connection between the first-external-terminal and an exposed portion of the first-conductive-layer between the first-semiconductor-element and the first-external-terminal; a first-external-control-terminal provided above a wire in the frame and between the first main electrode of the first-semiconductor-element and the first-external-terminal; and a first control terminal connecting portion establishing a connection: between the control electrode of the first-semiconductor-element and the first-external-control-terminal; and above a wire between the first main electrode of the first-semiconductor-element and the first-external-terminal.