Semiconductor Package Terminal Mounting Structure
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Solution Overview
Problem
The existing semiconductor device package assembly structure requires custom molds for each device model and specification, leading to high production costs and long lead times due to the need for human labor to manage different terminal arrangements and shapes.
Innovation Solution
A semiconductor device package structure with a common outer resin case featuring terminal mounting holes and a terminal clamping frame that allows for flexible arrangement of external terminals, enabling automated assembly and reducing the need for custom molds by using press-mounted terminals and adhesive bonding for secure positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external terminals are insert-molded into the outer resin case for each device model with custom terminal arrangements, then the terminals are securely positioned and arranged according to specifications, but production costs increase and lead times extend due to the need for custom molds and human labor
Solution Approach 1:
The outer resin case is designed with a standardized terminal mounting hole arrangement that can accommodate multiple device models and terminal configurations. Instead of creating custom molds for each model, a single universal mold produces cases with pre-defined hole patterns that work across different product specifications, enabling automated assembly and reducing both cost and lead time while maintaining reliable terminal positioning
Solution Approach 2:
The terminal mounting holes are pre-formed in the outer resin case during the molding process, before assembly. This preliminary preparation eliminates the need for post-molding terminal positioning operations and removes dependency on human labor for terminal arrangement, allowing automated assembly systems to efficiently install terminals in the correct positions without custom tooling for each model
2Adaptability or versatility
If custom forming molds are fabricated for each device model and specification, then terminal arrangements match specific product requirements, but manufacturing costs and management complexity increase
Solution Approach 1:
A single universal forming mold produces outer resin cases with standardized mounting hole patterns that can accommodate multiple terminal arrangements through selective hole usage. This universal approach reduces mold management complexity from managing multiple custom molds to managing one standardized mold, while still providing adaptability to different device models by configuring which pre-formed holes are used for terminal installation
Solution Approach 2:
The terminal mounting structure is segmented into standardized mounting holes distributed in a grid pattern within the outer resin case. This segmentation allows flexible selection and combination of holes to create different terminal arrangements for various device models, eliminating the need for custom integrated terminal designs while maintaining model-specific configuration capabilities
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for cost reduction and faster production by enabling the use of a common outer resin case across various models, improving assembly efficiency and bonding strength while maintaining dielectric strength and preventing terminal looseness.
Implementation Method 1
In this wiring process, an ultrasonic bonding method is used to connect the wires 7
Implementation Method 2
the periphery of the metal base 1 is bonded to the outer resin case 5 with an adhesive (for example a silicone adhesive)
Data Source
AI summary
A semiconductor device includes an outer resin case having a peripheral wall and terminal mounting holes formed in the peripheral wall, and a layer assembly provided in the outer resin case. The layer assembly includes a semiconductor chip, an insulating circuit board on which the semiconductor chip is mounted, and a heat-dissipating metal base. External terminals having leg portions are arranged in mounting holes of the peripheral wall, and are press-fitted into the terminal-mounting holes. Bonding wires connect the terminal leg portions and a conductive pattern of the insulating circuit board or the semiconductor chip.