Power Semiconductor Terminal Alignment for PCB Hole Insertion
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Solution Overview
Problem
Existing methods for mounting power semiconductor devices to printed circuit boards lack a simple and effective means of aligning the device's terminals with the board's contact holes, often resulting in bent or displaced terminals that fail to fit properly.
Innovation Solution
An alignment device is used to mount the power semiconductor device to the printed circuit board, featuring alignment structures that guide and support the terminals into the correct position, preventing bending and ensuring proper alignment through slots and sidewalls that limit terminal movement during insertion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If no alignment device is used during mounting, then the mounting process is simpler and faster, but the terminals become bent or displaced and fail to fit into contact holes properly
Solution Approach 1:
An alignment device is introduced as an intermediary component between the power semiconductor device and the printed circuit board. This alignment device includes alignment structures such as slots and sidewalls that guide the terminals during insertion, ensuring they remain properly aligned with contact holes while maintaining an efficient mounting process
2Manufacturing precision
If alignment structures with sidewalls are added to guide terminals, then terminal alignment precision improves, but the device complexity increases
Solution Approach 1:
The alignment device is segmented into distinct functional elements: alignment structures with slots for guiding terminal insertion, sidewalls for limiting lateral movement, and mounting structures for securing the device. This segmentation allows each component to perform its specific function efficiently while keeping the overall design manageable
Data Source
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AI summary
Method for mounting a power semiconductor device (10) to a printed circuit board (20) comprising the steps of providing the power semiconductor device (10) and an alignment device (30), inserting at least one terminal (11) of the power semiconductor device (10) into at least one first alignment structure (34) of the alignment device (30), concurrent with amounting the alignment device (30) to the power semiconductor device (10. The method further comprises the steps of providing the printed circuit board (20), aligning the alignment device (30) to the printed circuit board (20), concurrent with inserting at least partially a first portion (111) of the at least one terminal (11) into at least one contact hole (21) of the printed circuit board (20), and fixing the first portion (111) of the at least one terminal (11) of the power semiconductor device (10) to the printed circuit board (20).