Semiconductor Terminal Structure for Narrow-Pitch Alignment
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Solution Overview
Problem
The challenge of reducing the pitch between external connection terminals in semiconductor devices to minimize alignment deviations and prevent conductive failures between the element substrate and wiring board is addressed by incorporating an insulating portion with specific geometric features to guide the alignment of electrodes.
Innovation Solution
The semiconductor device incorporates an insulating portion with a top and lateral sides inclined relative to the top, where the width of the top is smaller than the diameter of the conductive particles, allowing for stable electrical connection even with alignment deviations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the pitch between external connection terminals is decreased to reduce device size, then the region of external connection terminals is reduced, but alignment deviation between wiring board and element substrate increases causing conductive failures
Solution Approach 1:
An insulating portion is introduced as an intermediary element between adjacent external connection terminals. This insulating portion acts as a physical guide that prevents wiring boards from deviating laterally during alignment, thereby maintaining reliable conductive connections even when the terminal pitch is reduced. The insulating portion mediates the interaction between the wiring board and terminals, ensuring proper alignment without requiring increased terminal width.
Solution Approach 2:
The space between adjacent external connection terminals is segmented by introducing insulating portions that physically separate and guide the alignment process. This segmentation creates distinct alignment zones that prevent wiring boards from shifting position, allowing for tighter terminal spacing while maintaining connection reliability through the guided alignment mechanism.
2Manufacturing precision
If external connection terminals are designed to be relatively wide to provide alignment margin, then alignment deviation is reduced, but the pitch between external connection terminals cannot be decreased
Solution Approach 1:
The insulating portion serves as a mediator that provides alignment guidance without requiring the terminals themselves to be wider. Instead of increasing terminal width to achieve alignment margin, the insulating portion mediates the alignment process by physically guiding the wiring board into the correct position, thereby achieving precise alignment with narrower terminals.
Solution Approach 2:
The solution moves the alignment margin from the horizontal dimension (terminal width) to the vertical dimension (insulating portion height). The insulating portion extends vertically between terminals and provides alignment guidance in this vertical dimension, allowing terminals to remain narrow in the horizontal dimension while still providing sufficient alignment margin.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the probability of conductive failures and allows for a narrower terminal pitch, thereby minimizing the device size without compromising electrical connectivity.
Implementation Method 1
it is necessary to align the wiring board and the element substrate so that an electrode of the wiring board is surely arranged on the external connection terminal of the element substrate
Data Source
AI summary
A semiconductor device comprises a first substrate; a functional element arranged on a main surface of the first substrate; a terminal connected to an electrode electrically connected to the functional element and arranged on a second substrate different from the first substrate; an insulating portion configured to cover an end of the terminal; and a conductive film arranged on the terminal and the insulating portion and containing a conductive particle, wherein in a section perpendicular to the main surface of the first substrate, the insulating portion includes a top and lateral sides inclined with respect to the top, and a width of the top is smaller than a diameter of the conductive particle.