Semiconductor Terminal Pressing Frame Adhesive Spreading Mechanism
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Solution Overview
Problem
Conventional semiconductor device packaging methods require multiple adhesive application steps and specific resin case designs for each model, leading to increased assembly time and cost due to the need for precise adhesive placement and limited use of resin cases as common components across different specifications.
Innovation Solution
The semiconductor device incorporates a resin case with terminal attachment holes and a terminal pressing frame forming first and second gaps, allowing for adhesive injection and spreading to fix the external terminal, terminal pressing frame, and metal base, reducing the number of adhesive application steps and enabling the use of a common resin case across various models.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple adhesive application steps are used to fix the external terminal and terminal pressing frame, then the bonding reliability is improved, but the assembly time and manufacturing complexity increase
Solution Approach 1:
The patent combines multiple adhesive application steps into a single injection process. Adhesive is injected into the resin case in one operation, and it automatically spreads to bond both the external terminal and the terminal pressing frame simultaneously. This merging of operations maintains bonding reliability while significantly reducing assembly time and manufacturing complexity.
Solution Approach 2:
The adhesive injection system is designed to automatically distribute adhesive throughout the resin case without requiring precise manual placement at multiple locations. The adhesive self-spreads to reach all necessary bonding surfaces, eliminating the need for multiple controlled application steps and reducing the skill level required for assembly.
2Manufacturing precision
If specific resin case designs with pre-assigned terminal attachment holes are used for each model, then the terminal positioning precision is improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The resin case is designed with a universal structure that can accommodate multiple terminal attachment configurations. Instead of creating different resin case designs for each model, a single resin case design with multiple potential attachment locations can serve multiple product models and specifications, reducing device complexity while maintaining positioning precision through selective use of attachment holes.
Solution Approach 2:
The terminal attachment structure is segmented into discrete, selectable attachment holes within a unified resin case. This allows the same resin case to be configured for different models by selecting which attachment holes to use, rather than requiring entirely different resin case designs for each model configuration.
3Strength
If adhesive is applied precisely at multiple specific locations, then the bonding strength is improved, but the manufacturing process complexity increases
Solution Approach 1:
Multiple adhesive application locations are merged into a single injection point. The adhesive is injected once into the resin case and automatically distributes itself to all necessary bonding locations, achieving strong bonds at multiple points without requiring multiple precise application operations, thereby simplifying the manufacturing process.
Solution Approach 2:
The adhesive system performs self-distribution after injection. Instead of requiring external intervention to place adhesive at multiple specific locations, the injected adhesive automatically flows and distributes itself to all bonding surfaces that require adhesion, maintaining bonding strength while greatly simplifying the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the assembly process, reduces costs by eliminating the need for multiple adhesive applications and specific resin case designs, and enhances the mechanical strength of the package structure by ensuring reliable adhesive distribution and fixation in three directions.
Implementation Method 1
The terminal pressing frame is coupled to the L-shaped leg portion by an adhesive of the first gap and coupled to the inside surface of the resin case by an adhesive of the second gap
Data Source
AI summary
A terminal pressing frame of a semiconductor device is disposed so as to form a first gap partially from the bottom surface of an L-shaped leg portion of an external terminal and a second gap from an inside surface of a resin case. Adhesive spreads to the second gap and further spreads to the first gap connected to the second gap, consequent to the pressure when a metal base is assembled. The spreading of the adhesive to the first gap fixes an L-shaped leg portion of the external terminal and the terminal pressing frame to each other; and the spreading of adhesive to the second gap fixes the resin case and the terminal pressing frame to each other.