Semiconductor Device Terminal Arrangement Flexibility
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing semiconductor devices configuring upper and lower arms have limited flexibility in arranging main terminals, which restricts design changes, such as capacitance adjustments, requiring changes to the molding die and reducing the degree of freedom in terminal arrangement.
Innovation Solution
Incorporating a semiconductor device with a resin molded body, multiple heat sinks, and relay members that allow the main terminals to be freely arranged by using auxiliary terminals and relay members, enabling changes in terminal connections without altering the terminal alignment, thus allowing for design flexibility without changing the molding die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If main terminals are arranged in a fixed alignment in the molding die, then manufacturing precision is maintained, but adaptability in terminal arrangement is limited
Solution Approach 1:
The patent divides the terminal arrangement system into two independent parts: (1) the molding die that maintains fixed terminal alignment for manufacturing precision, and (2) the relay members that provide flexible terminal connections after manufacturing. This segmentation allows the molding die to remain simple while achieving adaptability through the relay members that can be configured in different connection patterns.
Solution Approach 2:
The relay members act as intermediaries between the fixed terminal structures in the molding die and the desired flexible terminal arrangements. By introducing these intermediate connection elements, the patent enables variable terminal configurations (different capacitance adjustments and terminal orders) without requiring changes to the original molding die structure.
2Adaptability or versatility
If terminal connections are changed to adjust capacitance, then adaptability is improved, but manufacturing complexity increases due to molding die changes
Solution Approach 1:
The patent performs preliminary action by pre-configuring multiple relay members within the molding die during the initial manufacturing process. These relay members are positioned and connected in advance to handle various terminal connection requirements. When capacitance adjustment is needed, the system simply activates different pre-prepared relay member configurations rather than modifying the molding die structure.
Solution Approach 2:
The relay members are designed with multi-functionality to serve various terminal connection purposes. The same set of relay members can be configured to achieve different capacitance values and terminal arrangements by changing only the connection pattern, not the physical structure. This universal design allows a single molding die to produce multiple device variations.
3Adaptability or versatility
If auxiliary terminals and relay members are added to increase terminal arrangement freedom, then adaptability is improved, but device complexity increases
Solution Approach 1:
The patent merges the functions of multiple components into integrated structures. The relay members are combined with the terminal structures and heat sink connections, creating a unified assembly. Auxiliary terminals are merged with the existing terminal layout, and the relay members are integrated into the molding die structure. This merging reduces the perceived complexity by creating a cohesive design rather than separate additive components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the degree of freedom in arranging main terminals, allowing for changes in terminal order and capacitance adjustments without requiring a new molding die, improving productivity and reducing inductance while maintaining efficient heat dissipation.
Implementation Method 1
The semiconductor chips and the heat sinks are integrally sealed with a resin molded body (resin portion)
Implementation Method 2
a pair of first heat sinks disposed on opposite sides of the first semiconductor chip in the first direction, and a pair of second heat sinks disposed on opposite sides of the second semiconductor chip in the first direction
Data Source
AI summary
In a semiconductor device, a first semiconductor chip and a second semiconductor chip are aligned in a direction orthogonal to a plate thickness direction of the first semiconductor chip. A pair of first heat sinks is disposed on opposite sides of the first semiconductor chip in the first direction, and a pair of second heat sinks disposed on opposite sides of the second semiconductor chip in the first direction. The semiconductor chips and the heat sinks are sealed in a resin molded body. A plurality of main terminals are aligned in the second direction and project from a same side surface of a resin molded body. The main terminals includes a positive electrode terminal, a negative electrode terminal, an output terminal, and an auxiliary terminal. The first relay members are disposed in the resin molded body, and electrically connecting the main terminals and the corresponding heat sinks.