Semiconductor Terminal Structure for Thin Resin-Sealed Packaging
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Solution Overview
Problem
Existing methods for manufacturing semiconductor devices without using a lead frame face challenges in securing the pullout strength of terminals, which can lead to separation from the resin case, and are inefficient due to the need for complex photolithography processes.
Innovation Solution
A semiconductor device and manufacturing method that include forming a semiconductor element with electrodes, creating terminals electrically connected to the electrodes, and using a sealing resin to cover the terminals, with a conductive connection member contacting both the terminal and the electrode to enhance bonding and prevent separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If terminals are formed by plating on a metal base without using a lead frame, then the thickness of terminals can be reduced to about 20 μm, but the terminals become more likely to separate from the resin case
Solution Approach 1:
A metal base is formed beforehand on the resin case surface, and terminals are plated on this pre-formed base. This preliminary formation of the metal base ensures strong anchoring to the resin case before the thin terminal structure is created, preventing separation while maintaining thin terminal thickness
Solution Approach 2:
The terminal structure comprises a composite of metal base material and plated terminal material, combining the strength and anchoring properties of the metal base with the conductive and dimensional properties of the plated layer, achieving both thin profile and separation resistance
2Manufacturing precision
If complex photolithography processes are used for manufacturing semiconductor devices without lead frame, then manufacturing precision can be improved, but manufacturing efficiency decreases
Solution Approach 1:
The complex photolithography process is extracted and replaced with a simpler plating process. The metal base serves as a pre-formed template that eliminates the need for photolithography steps, maintaining precision through the structured base geometry while significantly improving manufacturing efficiency
Solution Approach 2:
The photolithography process (optical/chemical system) is replaced with an electrochemical plating process. This substitution maintains the precision of terminal formation through controlled deposition while eliminating the complexity and time requirements of photolithography
Data Source
AI summary
A semiconductor device is provided with a semiconductor element having a plurality of electrodes, a plurality of terminals electrically connected to the plurality of electrodes, and a sealing resin covering the semiconductor element. The sealing resin covers the plurality of terminals such that a bottom surface of the semiconductor element in a thickness direction is exposed. A first terminal, which is one of the plurality of terminals, is disposed in a position that overlaps a first electrode, which is one of the plurality of electrodes, when viewed in the thickness direction. The semiconductor device is provided with a conductive connection member that contacts both the first terminal and the first electrode.