Semiconductor Module Terminal Structure Without Welding
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Solution Overview
Problem
Existing semiconductor devices face challenges in reducing size while maintaining cost-effectiveness due to the increased size and manufacturing costs associated with joining methods like ultrasonic joining and laser welding.
Innovation Solution
A semiconductor module design that incorporates a semiconductor element, a conductor pattern with terminal contact portions, a sealing body, and an elastic member within a case with specific insertion portions, allowing for mechanical and electrical connection of external terminals without the need for laser welding or ultrasonic joining, using spring plates to apply pressing forces for connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ultrasonic joining or laser welding is used to join terminals and conductor patterns, then reliable electrical connection is achieved, but the device size increases and manufacturing cost increases
Solution Approach 1:
The patent extracts the joining process (ultrasonic joining or laser welding) from the terminal connection structure. Instead of joining terminals to conductor patterns, the invention uses a through-hole structure where terminals are inserted and fixed mechanically, eliminating the need for joining processes and reducing device size while maintaining electrical connection reliability
Solution Approach 2:
The patent replaces the thermal/mechanical joining system (ultrasonic or laser welding) with a simple mechanical insertion and fixation system. Terminals are inserted through holes in the insulating substrate and fixed with resin, substituting complex joining processes with a simpler mechanical assembly approach that reduces device size
2Reliability
If ultrasonic joining or laser welding is used to join terminals and conductor patterns, then reliable electrical connection is achieved, but manufacturing cost increases
Solution Approach 1:
The patent extracts the expensive joining processes (ultrasonic joining or laser welding) from the manufacturing sequence. By using a through-hole insertion structure with resin fixation, the invention eliminates these costly processes while maintaining reliable electrical connections, thereby reducing manufacturing cost
Solution Approach 2:
The patent employs simple, inexpensive components such as resin material for fixation and basic through-hole structures instead of requiring expensive joining equipment and processes. This approach uses cost-effective materials and methods to achieve reliable terminal connections without the high manufacturing costs associated with ultrasonic or laser welding
3Reliability
If height-intensive terminal contact portions are used for joining, then electrical connection is achieved, but device size increases
Solution Approach 1:
The patent extracts the height-intensive terminal contact portions from the device structure. Instead of using protruding terminals that require joining, the invention uses a through-hole structure where terminals pass through the insulating substrate and are fixed with resin, eliminating the need for tall contact portions while maintaining electrical connection
Solution Approach 2:
The patent transitions from a vertical height-based connection approach (tall terminal contact portions) to a horizontal planar approach (through-hole insertion with resin fixation). By changing the dimensional strategy from Z-height to XY-plane integration, the invention reduces the length of terminal contact portions while achieving reliable electrical connection
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables a reduction in semiconductor device size while controlling manufacturing costs by eliminating the need for height-intensive terminal contact portions and simplifying the joining process, thereby enhancing mechanical and electrical connectivity.
Implementation Method 1
an elastic member that, when an external terminal is inserted, applies a pressing force from a surface of the inserted external terminal
Data Source
AI summary
A semiconductor module includes: a semiconductor element; a conductor pattern including a terminal contact portion electrically connected to the semiconductor element; a sealing body provided to seal the semiconductor element and including an upper surface from which the terminal contact portion is exposed; a case provided with an accommodating portion configured to accommodate the sealing body; and an elastic member that, when an external terminal is inserted, applies a pressing force from a surface of the inserted external terminal opposite to a surface in contact with the terminal contact portion. The case is provided with a first insertion portion into which the external terminal is inserted.