Semiconductor Terminal Cut Structure for Solder Stress Relief
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Solution Overview
Problem
Existing semiconductor devices face challenges in maintaining a robust and durable terminal structure due to stress and heat generation, which can lead to peeling of solder materials and potential breakage under external or internal forces.
Innovation Solution
The semiconductor device incorporates a terminal structure with cuts and a molding member to enhance adhesion and alleviate stress, using copper conductive plates and a ceramic board to maintain electrical insulation and facilitate heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a terminal structure is used in semiconductor devices, then electrical connectivity is achieved, but stress and heat generation cause solder peeling and potential breakage
Solution Approach 1:
The terminal structure is divided into multiple segments including a body portion, a bent portion, and a lead portion. The bent portion acts as a separate stress-absorbing element that can deform independently to relieve thermal and mechanical stress from the solder joints, preventing solder peeling while maintaining electrical connectivity
Solution Approach 2:
The bent portion is pre-formed with a specific curvature radius before assembly, creating a built-in stress cushioning mechanism. This pre-formed geometry allows the terminal to absorb and distribute stress before it reaches the solder joints, preventing failure under thermal cycling and mechanical loading conditions
2Ease of manufacture
If rigid terminal structures are used, then manufacturing is simplified, but durability against external and internal stress is reduced
Solution Approach 1:
The terminal structure incorporates a bent portion with a defined curvature radius that allows controlled deformation. This dynamic element can flex and absorb stress during operation while returning to its original position, providing durability against stress without complicating the manufacturing process since the bent shape is formed during standard terminal fabrication
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design provides a highly reliable terminal structure that reduces the risk of solder peeling and enhances durability against external and internal stress, ensuring robust coupling and improved heat dissipation.
Implementation Method 1
a ceramic board, and a second copper conductive plate arranged on a lower surface of the ceramic board
Implementation Method 2
copper conductive plates and a ceramic board to maintain electrical insulation and facilitate heat dissipation
Data Source
AI summary
According to one embodiment, a semiconductor device includes first and second circuit boards, a first semiconductor chip, a first column and a first terminal. The second circuit board is provided above the first circuit board. The first semiconductor chip is provided between the first and second circuit boards. The first column is provided between the first and second circuit boards. The first terminal is provided at an end of the first circuit board in a first direction, and has a first cut. The first cut of the first terminal has a first part, a second part, and a third part. The first part extends from an end of the first terminal in the first direction. The second part is continuous with the first part and extends in a second direction crossing the first direction. The third part is continuous with the second part and extends in the first direction.