Semiconductor Module Terminal Support for Warpage-Induced Misalignment
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Solution Overview
Problem
Conventional semiconductor modules experience positional displacement or deformation of terminals due to warpage, deformation, or spring back of the resin mold.
Innovation Solution
A semiconductor module design that includes support members to fix and bundle terminals, using a first support member for control terminals and a second support member for power terminals, which are formed from a resin material and extend perpendicularly to the terminals to maintain spacing and stability, thereby suppressing deformation and positional displacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If terminals are formed on a resin mold, then the semiconductor module can be manufactured with integrated structure, but positional displacement or deformation of terminals occurs due to warpage, deformation, or spring back of the terminal
Solution Approach 1:
The invention divides the terminal structure into multiple segments: the terminal body formed on the resin mold and the terminal extension portion that protrudes from the resin mold. This segmentation allows the terminal extension portion to be independently positioned and fixed by support members, thereby maintaining manufacturing precision while preserving the integrated structure benefit.
Solution Approach 2:
The invention introduces support members as intermediary elements between the terminal extension portions and the external environment. These support members physically constrain the terminal extension portions, preventing warpage, deformation, and spring back, thus resolving the positional accuracy issue while maintaining the integrated resin mold structure.
2Manufacturing precision
If support members are added to fix terminals, then positional displacement and deformation are suppressed, but device complexity increases
Solution Approach 1:
The invention merges the support members with the terminal extension portions by having the support members directly contact and constrain the terminal extension portions. This integration reduces the need for separate complex fixing mechanisms, thereby suppressing positional displacement while minimizing the increase in device complexity.
Solution Approach 2:
The support members serve multiple functions: they position the terminal extension portions, prevent warpage, suppress deformation, and maintain spacing between adjacent terminals. This multi-functionality reduces the need for additional specialized components, thereby limiting the increase in device complexity while achieving comprehensive terminal stabilization.
3Manufacturing precision
If terminal extension portions protrude from resin mold, then positional rectification is improved, but risk of peeling between resin mold and terminal increases
Solution Approach 1:
The invention performs preliminary positioning of the terminal extension portions using support members before the bonding process. By pre-establishing the correct position and orientation of the terminal extension portions, the risk of peeling during subsequent processing is reduced, as the terminals are already properly aligned and constrained.
Solution Approach 2:
The invention changes the physical state and parameters of the resin mold by controlling the curing process of the resin. By optimizing the curing conditions and resin properties, the bonding strength between the resin mold and terminal extension portions is enhanced, thereby preventing peeling while maintaining the positional rectification benefits of the protruding terminal extension portions.
Data Source
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AI summary
A semiconductor module includes: a plurality of semiconductor switching elements; a resin mold having a side surface and surrounding the plurality of the semiconductor switching elements; a terminal member having a plurality of inner terminals electrically connected to the plurality of the semiconductor switching elements inside the resin mold and a plurality of outer terminals protruding from the side surface of the resin mold; and a support member disposed at a position apart from the side surface of the resin mold, the support member extending in a direction in which the plurality of the outer terminals are arrayed, the support member covering a part of an outer-periphery of each of the plurality of the outer terminals, the support member fixing the plurality of the outer terminals such that the plurality of the outer terminals are spaced from each other.