Semiconductor Module Terminal Structure for Lower Thermal Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor modules experience excessive temperature rise due to insufficient thermal resistance between main terminals and base plates, leading to elevated temperatures in external terminals and bonding wires.
Innovation Solution
Incorporating a heat radiation plate with a first insulating substrate and a frame-shaped case, where external terminals are electrically connected via bonding wires, and at least one second insulating substrate with higher heat conductivity is interposed between the heat radiation plate and external terminals, bonded using a heat conductive material and joined by press-fitting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a high heat dissipation insulator is arranged between the base plate and the main terminal and fixed by insert molding, then thermal resistance reduction is intended, but the main terminal and the insulator tend to be in a non-contact state during assembly, resulting in insufficient thermal resistance reduction
Solution Approach 1:
A second insulating substrate with high heat conductivity is introduced as an intermediary component between the base plate and the main terminal. This mediator ensures reliable thermal contact while maintaining electrical insulation, solving the problem of insufficient thermal contact in the conventional insert molding method.
Solution Approach 2:
The invention changes the heat conductivity parameter by selecting a second insulating substrate with heat conductivity greater than that of the case material. This parameter optimization enables effective heat dissipation while maintaining the insulating function.
2Ease of manufacture
If the main terminal and bonding wire are in a non-contact state, then assembly is simplified, but excessive temperature rise occurs in the main terminal and bonding wire
Solution Approach 1:
The second insulating substrate serves as a thermal mediator that facilitates heat transfer from the main terminal and bonding wire to the base plate. This intermediary component enables effective heat dissipation without complicating the assembly process, as it can be integrated into the existing structure.
Solution Approach 2:
The thermal management function is segmented into multiple components: the base plate for heat dissipation, the second insulating substrate for thermal conduction and electrical insulation, and the main terminal for electrical connection. This segmentation allows each component to optimize its specific function while working together for effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces thermal resistance between the second insulating substrate and the heat radiation plate, and between the external terminals and the second insulating substrate, thereby suppressing temperature rise in the external terminals and bonding wires.
Implementation Method 1
the at least one second insulating substrate and the first surface of the heat radiation plate are bonded to each other by a heat conductive bonding material
Implementation Method 2
at least one second insulating substrate disposed between the heat radiation plate and the plurality of external terminals and having heat conductivity greater than that of the case
Data Source
AI summary
A semiconductor module includes: a heat radiation plate; a first insulating substrate disposed on a first surface of the heat radiation plate and having a semiconductor chip provided thereon; a frame-shaped case surrounding the first insulating substrate; external terminals provided across the inside and the outside of the case and electrically connected to the semiconductor chip via a bonding wire; and at least one second insulating substrate disposed between the heat radiation plate and the external terminals and having heat conductivity greater than that of the case. The second insulating substrate and the first surface of the heat radiation plate are bonded to each other by a heat conductive bonding material. Each external terminal and the second insulating substrate are joined to each other by press-fitting.