Semiconductor Package Terminal Layout for TIM Heat Dissipation
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Solution Overview
Problem
Existing semiconductor storage devices face challenges in improving heat dissipation efficiency due to limited heat dissipation areas and poor thermal conductivity from point contact between terminals and the printed circuit board.
Innovation Solution
The semiconductor storage device is designed with a terminal arrangement that allows for expanded surface contact with a thermal interface material (TIM) by reducing the number of terminals in certain rows and providing a larger contact area, enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional terminal arrangement is used, then electrical connection is maintained, but heat dissipation area is limited and thermal conductivity is poor
Solution Approach 1:
The patent transitions from point contact (0D/1D) to surface contact (2D) by creating a pad structure that extends vertically from the terminal surface. This dimensional change allows the TIM to contact a larger area, improving heat dissipation efficiency while maintaining electrical connection functionality.
Solution Approach 2:
The terminal structure is segmented into distinct functional regions: an electrical connection portion for signal transmission and a pad portion for heat dissipation. This segmentation allows each portion to be optimized independently - the pad portion provides extended surface area for thermal management while the connection portion maintains electrical integrity.
2Temperature
If terminal rows are reduced to expand contact area, then heat dissipation improves, but device complexity may increase
Solution Approach 1:
The pad structure serves multiple functions simultaneously: it provides electrical connection, thermal conduction path, and mechanical support. This multi-functionality reduces the need for separate dedicated heat dissipation components, thereby managing device complexity while achieving improved thermal performance.
Solution Approach 2:
The patent merges the electrical connection function and heat dissipation function into a single integrated terminal structure. The pad portion of each terminal acts as both an electrical contact point and a thermal interface, eliminating the need for separate heat dissipation mechanisms and reducing overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves heat dissipation efficiency by increasing the heat dissipation area through surface contact with the TIM, compared to traditional point contact, thereby improving thermal conductivity and reducing thermal resistance.
Implementation Method 1
The contact area comes in contact with a thermal interface material in a host device. This design improves heat dissipation efficiency by increasing the heat dissipation area through surface contact with the TIM, compared to traditional point contact, thereby improving thermal conductivity and reducing thermal resistance.
Data Source
AI summary
According to one embodiment, a semiconductor storage device includes a plurality of terminals. The plurality of terminals form at least a first row and a second row. The first row includes a plurality of terminals arranged in a first direction at intervals from each other at locations closer to a first end edge than to a second end edge. The second row includes a plurality of terminals arranged in the first direction at intervals from each other at locations closer to the second end edge than to the first end edge. An area between the first row and the second row on a first surface includes a contact area that is in contact with a heat-conducting member, which is disposed on a printed circuit board in a host device that is electrically connected to the semiconductor storage device.