Semiconductor Terminal Structure with Uneven Surface for Bending Stress Relief
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Solution Overview
Problem
The existing terminal casing structures for semiconductor modules are prone to cracking during bending, leading to increased electrical resistance and corrosion due to tensile stress, which affects the bonding and efficiency of the semiconductor module.
Innovation Solution
A terminal structure with unevenness, such as V-grooves or protrusions, is introduced on the plate surfaces to increase the surface area, allowing for elongation without cracking and reducing stress concentration, thereby preventing terminal cracking and corrosion while maintaining electrical integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If a plate-shaped terminal is bent to form a terminal casing, then the terminal can be shaped to house semiconductor devices, but tensile stress concentrates on the outer curved surface causing cracks
Solution Approach 1:
The patent applies local quality by creating unevenness (protrusions or hollows) only in specific predetermined regions on the plate surface that correspond to the outer curved surface during bending. This localized structural modification allows the terminal to maintain smooth overall curvature while providing stress-relief features exactly where tensile stress concentrates, preventing cracks without compromising the terminal's ability to form the required casing shape.
Solution Approach 2:
The patent resolves the bending stress problem by transitioning from a two-dimensional flat plate to a three-dimensional uneven surface with protrusions or hollows. This dimensional change adds vertical relief features that allow the material to accommodate tensile stress through localized deformation of the unevenness features rather than creating cracks in the planar surface, enabling successful bending while maintaining strength.
2Area of stationary object
If the terminal surface area is increased to allow elongation during bending, then crack generation is prevented, but the terminal structure becomes more complex
Solution Approach 1:
The patent applies segmentation by dividing the continuous plate surface into multiple discrete unevenness features (protrusions or hollows) distributed across predetermined regions. Instead of creating one large complex undulating surface, the terminal surface is segmented into multiple small, standardized unevenness elements, each contributing to stress distribution while maintaining manufacturing simplicity and structural clarity.
Solution Approach 2:
The patent utilizes parameter changes by modifying the surface topology through controlled unevenness features with specific dimensions, depths, and distributions. These parameter modifications (adding height variation and surface texture) enable the terminal to accommodate bending elongation while the features themselves can be standardized and controlled through manufacturing parameters, balancing enhanced functionality with structural manageability.
Data Source
AI summary
A terminal structure of a terminal used for connecting a semiconductor device included in a semiconductor module to an outside element, including plate-shaped portions at both ends, and a bent portion positioned between the plate-shaped portions. The bent portion has an outer surface at an outer side of the bent portion, and an inner surface at an inner side of the bent portion. The outer surface has a first uneven surface including a plurality of hollow portions and/or a plurality of protruding portions.