Semiconductor Module Terminal Support for Warpage Control
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Solution Overview
Problem
Conventional semiconductor modules experience positional displacement or deformation of terminals due to warpage, deformation, or spring back of the terminal generated on a resin mold.
Innovation Solution
A semiconductor module design that includes a resin mold surrounding semiconductor switching elements, a terminal member with inner and outer terminals, and support members extending to cover and space the outer terminals, fixing them to prevent displacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If terminals are bent to achieve three-dimensional structure, then terminal arrangement flexibility is improved, but positional displacement and deformation occur due to warpage and spring back
Solution Approach 1:
The support member is provided in advance during the molding process to prevent warpage and deformation before the terminals are bent. This preliminary support structure ensures that the terminals maintain their intended positions and shapes after bending, eliminating the spring back effect that would otherwise cause positional displacement.
Solution Approach 2:
The support member acts as an intermediary element between the resin mold and the terminals. It provides mechanical support to the terminals during the molding process, preventing them from deforming due to resin pressure and warpage, while allowing the terminals to be bent into the desired three-dimensional configuration afterward.
2Device complexity
If resin mold is used to surround semiconductor switching elements, then structural integration is improved, but warpage occurs causing terminal deformation
Solution Approach 1:
The support member is divided into multiple sections corresponding to different terminal groups. Each section provides localized support to specific terminals, allowing the resin mold to maintain high structural integration while the segmented support member prevents warpage-induced deformation of individual terminal groups.
Solution Approach 2:
The support member provides localized support only where terminals are positioned, rather than uniformly supporting the entire resin mold. This local quality approach maintains the structural integration benefits of the resin mold while preventing deformation specifically at the terminal locations where it is most critical.
Data Source
AI summary
A semiconductor module includes: a plurality of semiconductor switching elements; a resin mold having a side surface and surrounding the plurality of the semiconductor switching elements; a terminal member having a plurality of inner terminals electrically connected to the plurality of the semiconductor switching elements inside the resin mold and a plurality of outer terminals protruding from the side surface of the resin mold; and a support member disposed at a position apart from the side surface of the resin mold, the support member extending in a direction in which the plurality of the outer terminals are arrayed, the support member covering a part of an outer-periphery of each of the plurality of the outer terminals, the support member fixing the plurality of the outer terminals such that the plurality of the outer terminals are spaced from each other.