Semiconductor Terminals With Roughened Bend Zones for End Alignment
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Solution Overview
Problem
In semiconductor devices, uneven spring back during terminal bending can lead to misalignment of terminal ends, making connection to a connector difficult or requiring re-bending, due to inconsistent plastic deformation across terminals.
Innovation Solution
Incorporating a rough surface area with higher surface roughness in the longitudinal direction of the terminals, which acts as a locally fragile portion, allowing controlled plastic deformation and predictable spring back, ensuring uniform bending and accurate alignment of terminal ends.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If uniform bending is applied to terminals, then the bending process is simple, but uneven spring back occurs causing misalignment of terminal ends
Solution Approach 1:
The patent applies local quality by creating a rough surface area at a specific location on the terminal surface. This localized roughness treatment modifies the plastic deformation characteristics only in that specific region, allowing controlled spring back at the rough surface area while maintaining uniform bending application across all terminals. The rough surface area acts as a localized zone that absorbs or redistributes deformation stress, preventing the uneven spring back that would otherwise occur with uniform bending.
2Ease of operation
If terminal positions are not aligned, then connection to connector becomes difficult, but re-bending some terminals increases process complexity
Solution Approach 1:
The patent implements preliminary action by pre-forming the rough surface area on terminals during the manufacturing process, before the final bending and connection operations. This preliminary surface treatment ensures that when uniform bending is subsequently applied, the terminals will exhibit predictable and uniform spring back behavior, resulting in properly aligned terminal ends ready for connector connection without requiring selective re-bending.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The rough surface area enables controlled plastic deformation, preventing misalignment of terminal ends and facilitating uniform bending, thereby simplifying the connection process to a connector.
Implementation Method 1
The rough surface area has a larger surface roughness than a peripheral area... acts as a locally fragile portion, allowing controlled plastic deformation and predictable spring back
Data Source
AI summary
A semiconductor device includes a semiconductor element, a sealing body, and a plurality of terminals. The sealing body seals the semiconductor element therein. The terminals are electrically connected to the semiconductor element inside of the sealing body, and project from the sealing body. Each of the terminals has a rough surface area having a larger surface roughness than a peripheral area in a section in a longitudinal direction of the terminal.