Semiconductor Test Apparatus Chamber Ambient Cooling
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Solution Overview
Problem
Conventional semiconductor test apparatuses face challenges in reaching specified test temperatures due to ambient temperature influences, leading to increased complexity and cost from refrigeration systems, especially when trying to cool below ambient temperature.
Innovation Solution
A semiconductor test apparatus with a refrigeration element connected to the test chamber to lower the chamber ambient temperature, eliminating the need for internal refrigeration pipelines and using a refrigeration capacity sufficient for small temperature adjustments, combined with a temperature sensor and controller for precise temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a refrigeration pipeline is arranged inside the chuck to cool the semiconductor element, then the chuck can reach specified test temperatures below ambient temperature, but the organizational complexity and cost of the test apparatus increase significantly
Solution Approach 1:
The refrigeration pipeline is extracted from the chuck structure and relocated to the test chamber. The chuck no longer contains internal cooling channels,而是 relies on the refrigeration element in the test chamber to cool the ambient air, which then cools the chuck indirectly. This extraction simplifies the chuck design and reduces overall system complexity.
Solution Approach 2:
The ambient air in the test chamber serves as an intermediary medium between the refrigeration element and the chuck. The refrigeration element cools the air, and the cooled air subsequently cools the chuck and semiconductor element. This intermediary approach eliminates the need for direct thermal contact through complex internal pipelines.
2Temperature
If a refrigeration pipeline with consumable refrigerant is used to cool the chuck, then the specified test temperature can be achieved, but the cost of semiconductor testing increases due to refrigerant consumption
Solution Approach 1:
The test chamber's ambient air serves as the refrigerant, utilizing the air already present in the closed chamber. The refrigeration element circulates and cools this air continuously without requiring external refrigerant supply or consumption. The air absorbs heat from the chuck and releases it to the refrigeration element, creating a self-sustaining cooling cycle.
3Temperature
If the ambient temperature of the test chamber is high, then the chuck cannot reach specified test temperatures, but adding complex refrigeration systems increases cost and complexity
Solution Approach 1:
The refrigeration element in the test chamber serves multiple functions: it cools the ambient air in the chamber, which in turn cools both the chuck and any other components within the chamber. This single refrigeration element provides universal cooling for the entire test environment, eliminating the need for separate cooling systems for different components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the cooling system, reduces costs, and eliminates the need for consumable refrigerants, allowing the chuck and semiconductor element to reach specified test temperatures efficiently while maintaining a lower ambient temperature.
Implementation Method 1
Heat exchange undertakes between the refrigerant gas/liquid and the chuck 12 to lower the temperature of the chuck 12
Implementation Method 2
Heat exchange undertakes between the refrigerant gas/liquid and the chuck 12
Data Source
AI summary
A semiconductor test apparatus includes a test chamber, a chuck and a refrigeration element. The chuck is arranged in the test chamber to fix a semiconductor element to be tested. The refrigeration element is connected to the test chamber to reduce a chamber ambient temperature of the test chamber from a first temperature to a second temperature. The foregoing semiconductor test apparatus is able to reduce the chamber ambient temperature of the test chamber to be equal to or lower than the specified test temperature.