Semiconductor Test Connecting Unit with Selective Cable Coupling
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Solution Overview
Problem
Conventional methods require separate printed circuit boards with specific patterns to be manufactured for each type of semiconductor chip, making it inefficient to perform electrical tests on semiconductor chips with varying contact terminal patterns, as the pattern on the printed circuit board cannot be modified after manufacturing.
Innovation Solution
A connecting unit with a plurality of connectors and cables that can selectively connect to semiconductor chips with various patterns of electrical connection terminals, using conductive protrusions, support bodies, and hook bodies to facilitate electrical connection and disconnection, allowing for direct connection to the semiconductor chips without a conventional printed circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a printed circuit board with a specific pattern is manufactured to correspond to the contact terminals of semiconductor chips, then electrical connection is achieved, but the pattern cannot be modified after manufacturing and separate boards must be prepared for different chip patterns
Solution Approach 1:
The printed circuit board is divided into multiple selectable connection patterns, where only the required pattern is activated through selective connection of conductive protrusions to corresponding cable groups, allowing a single board to serve multiple chip types
Solution Approach 2:
The connection pattern is made dynamically selectable through the coupling unit mechanism, which allows conductive protrusions to be connected or disconnected from cable groups based on the specific semiconductor chip being tested, enabling pattern reconfiguration without manufacturing new boards
2Reliability
If separate printed circuit boards are prepared for each semiconductor chip pattern, then accurate electrical connection is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
A single printed circuit board is designed with multiple connection patterns integrated into it, allowing the same board to accurately connect to different semiconductor chip patterns by selecting and activating the appropriate connection pattern through the coupling unit and conductive protrusion mechanism
3Manufacturing precision
If the pattern on the printed circuit board is fixed after manufacturing, then manufacturing precision is maintained, but ease of manufacture decreases as re-manufacturing is required for different patterns
Solution Approach 1:
Multiple connection patterns are pre-formed on the printed circuit board during manufacturing, but remain inactive until needed. The required pattern is then activated through selective connection of conductive protrusions to cable groups, combining manufacturing precision with operational flexibility
Data Source
AI summary
A connecting unit to test a semiconductor chip and an apparatus to test the semiconductor chip having the same include a plurality of connectors, on which a semiconductor chip having a certain pattern of electrical connection terminals, having a plurality of holes, cables configured to electrically connect the electrical connection terminals to the exterior, and coupling units configured to selectively electrically connect the cables to the electrical connection terminals through the holes. Therefore, it is possible to perform electrical tests of semiconductor chips having various patterns of electrical connection terminals and receive the semiconductor chips in a tray at a time.