Semiconductor Test Data Interface for High-Frequency Chip-on-Chip
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Solution Overview
Problem
Current semiconductor device testing methods for chip-on-chip packages face challenges in effectively verifying the data interface and setup/hold characteristics, particularly in high-frequency operations, due to limitations in testing data transmission and alignment of signals through micro-bump pads.
Innovation Solution
The semiconductor device incorporates a test data interface and strobe signal interface that generate aligned data and strobe signals in synchronization with a test control signal, enabling the evaluation of data interface normality and setup/hold characteristics by comparing signals across multiple pads, thereby facilitating comprehensive testing of data transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If micro-bump pads are used for data transmission in chip-on-chip packages, then data transmission speed is improved, but testing complexity increases
Solution Approach 1:
The patent introduces a test pad as an intermediary element that interfaces with the memory chip through micro-bump pads. This test pad serves as a mediator between external testing equipment and the internal data interfaces, enabling comprehensive testing of data transmission and alignment characteristics without requiring direct access to all internal signal paths.
Solution Approach 2:
The patent segments the testing function into multiple independent interfaces: a test data interface for data signal testing, a test strobe signal interface for clock signal testing, and alignment evaluation circuits. This segmentation allows each interface to be tested independently, simplifying the overall testing process while maintaining comprehensive coverage of high-speed data transmission characteristics.
2Speed
If multiple micro-bump pads are employed to increase data transmission capacity, then data transmission speed improves, but measurement precision of interface characteristics deteriorates
Solution Approach 1:
The patent implements local quality by providing dedicated test circuits and interfaces for specific signal characteristics. The test data interface is specifically designed to evaluate data signal integrity, while the test strobe signal interface is optimized for clock signal characteristics. This localized testing approach ensures high measurement precision for each interface type despite the presence of multiple micro-bump pads.
Solution Approach 2:
The patent replaces physical access to multiple micro-bump pads with electrical signal routing through the test pad. Instead of mechanically accessing each micro-bump pad individually for testing, the invention uses electrical signal paths that can be controlled and measured through the single test pad interface, maintaining measurement precision while accommodating high transmission capacity.
3Reliability
If comprehensive testing of data interface and setup/hold characteristics is performed, then reliability improves, but testing time increases
Solution Approach 1:
The patent implements preliminary action by pre-configuring the test pad with integrated test circuits that are ready to perform comprehensive interface testing. The test data interface and test strobe signal interface are pre-designed to automatically evaluate setup and hold characteristics, eliminating the need for complex external testing setups and reducing overall testing time while maintaining high reliability.
Solution Approach 2:
The patent merges multiple testing functions into a single integrated test pad structure. The test data interface, test strobe signal interface, and alignment evaluation circuits are combined in one location, allowing comprehensive testing of data transmission reliability to be performed simultaneously through a single interface rather than requiring separate testing procedures for each characteristic.
Data Source
AI summary
A semiconductor device includes a test data interface, a first data interface, and a second data interface. The test data interface generates first test data and second test data from data inputted through a test pad in response to a test control signal and outputs failure information to the test pad in response to a read control signal. The first data interface generates first aligned data from the first test data or the second test data in response to the test control signal. The second data interface generates second aligned data from the second test data.