Semiconductor Test Equipment for Undivided PCBs

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current test equipment for semiconductor devices mounted on unit printed circuit boards (PCBs) lacks efficiency in testing processes, particularly for undivided PCBs with differently arranged unit PCBs, leading to inefficiencies in electrical connection and main tests.

Innovation Solution

A test equipment system that loads undivided PCBs into a test equipment, confirms product information, electrically connects them to main testers connected to a cloud server for firmware updates and tests, performs electrical connection and main tests, and classifies results for effective unloading and storage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional test equipment is used for unit PCBs, then existing testing capability is maintained, but efficiency deteriorates when testing undivided PCBs with different unit PCB arrangements

Engineering Contradiction:
Improvetesting efficiencyVSAvoidadaptability to different unit PCB arrangements
Core Design Contradiction:
ProductivityVSAdaptability or versatility

Solution Approach 1:

The test equipment is designed with a universal testing platform that can accommodate multiple types of undivided PCBs with different unit PCB arrangements. The system includes a loading part with a loading stage that can receive various undivided PCB configurations, and a test part with a test stage that can adapt to different testing requirements. The controller is configured to control different operations based on the type of undivided PCB loaded, enabling the equipment to efficiently test various semiconductor device configurations without requiring separate specialized equipment for each arrangement type.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Productivity

If manual testing procedures are used for undivided PCBs, then device complexity is reduced, but productivity deteriorates due to time-consuming manual operations

Engineering Contradiction:
Improvetesting speedVSAvoidautomation system complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The test equipment incorporates automated operations where the loading stage automatically loads undivided PCBs onto the testing platform, and the controller automatically executes testing sequences based on pre-configured parameters. The system includes automatic classification functionality that separates tested undivided PCBs into different categories based on test results, eliminating the need for manual sorting. This automation significantly improves testing speed while the modular design of the automated system keeps the complexity manageable through standardized components and procedures.

Inventive Principle:
Principle #25Self-service

3Measurement precision

If comprehensive testing of undivided PCBs is performed, then measurement precision is improved, but loss of time increases due to extended testing duration

Engineering Contradiction:
Improvetesting accuracyVSAvoidtesting cycle time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The system performs preliminary classification of undivided PCBs at the loading stage before they enter the main testing sequence. The controller is pre-configured with testing parameters and sequences corresponding to different types of undivided PCBs, so that once a PCB is loaded and identified, the appropriate test sequence can be immediately executed without delays. This preliminary preparation of testing parameters and classification criteria enables comprehensive testing to be performed efficiently, maintaining both accuracy and reduced cycle time.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS9618568B2Test equipment for testing semiconductor device and methods of testing semiconductor device using the same
Publication Date: 2017.04.11 SAMSUNG ELECTRONICS CO LTD
  • US9618568B2 patent drawing
  • US9618568B2 patent drawing
  • US9618568B2 patent drawing

AI summary

A method of testing a semiconductor device using the test equipment includes loading an undivided printed circuit board (PCB) including unit PCBs in a test equipment. A semiconductor device is mounted in each of the unit PCBs. Product information of the undivided PCB loaded in the test equipment is confirmed. The undivided PCB whose product information has been confirmed is electrically connected to one of a plurality of main testers of the test equipment. Each of the main testers includes a main test interface directly connected to a cloud server in which firmwares for various kinds of tests are stored. The product information of the undivided PCB is transmitted to the main tester electrically connected to the undivided PCB. The main tester to which the product information has been transmitted performs a main test of the undivided PCB using the product information. The undivided PCB on which the main test has been performed by the main tester is unloaded from the test equipment.