Semiconductor Test Handler Temperature Control via Liquid Cooling
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Solution Overview
Problem
Conventional handlers for semiconductor devices struggle to maintain a constant inner temperature during parallel testing, especially as the number of high-speed devices increases, leading to temperature control limitations due to heat generation and position-dependent temperature variations.
Innovation Solution
The test chamber is partitioned into multiple spaces with separate temperature control chambers and the use of a temperature-control medium, such as liquid coolant, flowing through pipelines to maintain stable temperatures, aided by thermoelectric materials and heat dissipation units, and the installation of multiple pressing units for stable device contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of semiconductor devices tested in parallel increases, then test productivity improves, but temperature control difficulty worsens due to increased heat generation
Solution Approach 1:
The test chamber is divided into multiple independently controllable zones with separate temperature control systems. Each zone can be adjusted independently to handle heat generation from multiple devices, allowing parallel testing while maintaining temperature control through localized management rather than uniform control of the entire chamber.
2Temperature
If air circulation fan position and airflow amount are adjusted to control temperature, then temperature uniformity improves, but device complexity increases
Solution Approach 1:
The patent replaces complex mechanical temperature control systems (multiple fans, adjustable airflow controls, heater position adjustments) with a simpler liquid cooling system using coolant circulation through channels. This substitution reduces the number of moving parts and control mechanisms while achieving better temperature uniformity through the liquid medium's superior heat transfer properties.
3Device complexity
If conventional air-cooled temperature controllers are used, then device complexity is low, but temperature stability deteriorates under high device density
Solution Approach 1:
The patent introduces a liquid cooling system using coolant circulation through channels embedded in or near the test chamber. This hydraulic system provides superior heat removal capability compared to air cooling, maintaining temperature stability even with high device density and heat generation, while the system structure remains relatively simple with standard coolant circulation components.
4Reliability
If multiple pressing units are installed to ensure stable device contact, then test reliability improves, but device complexity increases
Solution Approach 1:
Multiple pressing units are combined into an integrated pressing mechanism system that operates as a coordinated unit. The pressing units are configured to apply force simultaneously to multiple devices through a unified structure, ensuring stable electrical contact for all devices during parallel testing without requiring independent control and adjustment of each pressing unit, thereby reducing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively maintains stable temperatures across the test chamber, even with high numbers of high-speed semiconductor devices, preventing test yield degradation from temperature variations and ensuring consistent contact forces during testing.
Implementation Method 1
the use of a temperature-control medium, such as liquid coolant, flowing through pipelines to maintain stable temperatures
Implementation Method 2
liquid coolant, flowing through pipelines
Implementation Method 3
aided by thermoelectric materials
Implementation Method 4
heat dissipation units
Data Source
AI summary
A semiconductor device test handler for maintaining stable temperature in a test environment may include a loading unit that loads a plurality of semiconductor devices mounted on a test tray; a soak chamber configured to receive the test tray from the loading unit and to age the semiconductor devices at an aging temperature; and a test chamber configured to receive and test the aged semiconductor devices. The test chamber may include: a test board; a first chamber; a second chamber; one or more pipelines connected to the first and second chambers that allow a temperature-control medium to flow between the first and second chambers; a de-soak chamber that further ages the tested semiconductor devices so that the tested semiconductor devices substantially return to ambient temperature; and a sorting and unloading unit that sorts the tested semiconductor devices according to results of the test and that unloads the sorted semiconductor devices.