Semiconductor Test Handler Rapid Temperature Change via Fluid Path
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Solution Overview
Problem
The increasing capacity of memory semiconductor devices has led to a significant increase in the time required for electrical testing, and existing test handlers struggle to efficiently change the temperature of semiconductor devices rapidly, limiting the efficiency of the testing process.
Innovation Solution
A test handler with a tri-chamber processing unit that includes a soak chamber, a test chamber, and an exit chamber, equipped with a fluid path for circulating coolant or heat medium, allowing for rapid temperature changes between temperatures less than and greater than room temperature, along with a stocker/loader and unloader/sort stocker to manage semiconductor devices and sort them based on test results.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If cooling air or heated air is used to change the temperature of semiconductor devices, then the temperature can be changed, but the temperature change is not rapid enough
Solution Approach 1:
The patent uses a fluid path system with coolant or heat medium circulating through the chamber walls to rapidly change temperatures. This hydraulic approach replaces the less efficient air-based heating/cooling method, enabling fast temperature transitions between room temperature, lower temperatures, and higher temperatures during the test process.
Solution Approach 2:
The patent changes the physical state and temperature parameters of the semiconductor devices by circulating coolant or heat medium through the chamber walls. This allows rapid transition between different temperature conditions (room temperature, lower temperature, higher temperature) required for comprehensive testing.
2Reliability
If the test process is extended to include multiple temperature conditions, then the testing thoroughness is improved, but the test waiting time increases
Solution Approach 1:
The patent uses a soak chamber to pre-cool or pre-heat semiconductor devices before they enter the test chamber. This preliminary temperature conditioning ensures devices are at the required test temperature before actual testing begins, eliminating waiting time during the test process and enabling continuous operation.
Solution Approach 2:
The patent maintains continuous testing operation by having multiple chambers (soak chamber and test chamber) that can operate simultaneously at different temperatures. While one chamber is testing devices, another is pre-conditioning the next batch, ensuring continuous useful action without idle waiting time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution minimizes test waiting time and increases operational efficiency by enabling rapid temperature changes and efficient testing of semiconductor devices at various temperatures, improving the overall testing process.
Implementation Method 1
a fluid path in which coolant or heat medium circulates in the walls so that a temperature of the chamber can be rapidly changed in the test process of the semiconductor devices between a first temperature that is less than room temperature and a second temperature that is greater than room temperature
Implementation Method 2
coolant or heat medium circulates in the walls
Data Source
AI summary
A test handler and a test method of a semiconductor device using the same includes a plurality of chambers to provide a sealed inner space accommodating a first tray on which semiconductor devices are mounted, a test module electrically connected to the semiconductor devices in the chambers to perform a test process of the semiconductor devices, and a sort part to load and unload the first tray in the chambers and to sort semiconductor devices determined to be failed in the test process. The plurality of chambers have a fluid path circulating a coolant or a heat medium in the walls so that a temperature of the plurality of chambers is rapidly changed at the test process of the semiconductor devices between a first temperature that is less than room temperature and a second temperature that is greater than room temperature.