Semiconductor Test Apparatus Isolation Circuit for Burn-In Continuity
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Solution Overview
Problem
Conventional semiconductor test apparatuses face challenges in continuing the burn-in test for semiconductor devices with good device characteristics when a deficiency occurs, as the test circuit is short-circuited, affecting other devices during simultaneous voltage application.
Innovation Solution
The semiconductor test apparatus includes first and second switches connected to the semiconductor devices, allowing for the disconnection of defective devices from the low-voltage side and raising the potential of their source electrodes to the high-voltage terminal, enabling the continuation of testing without affecting other devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If voltage is simultaneously applied to a plurality of semiconductor devices to perform burn-in test, then test time is reduced and productivity is improved, but if a deficiency occurs in any device, the test circuit is short-circuited and the test cannot be continued for other good devices
Solution Approach 1:
The test circuit is segmented into independent test paths for each semiconductor device by providing individual first switches and second switches for each device. This segmentation allows one defective device to be isolated without affecting the test continuity of other devices, resolving the contradiction between high throughput and test continuity.
Solution Approach 2:
First switches and second switches act as intermediary elements between the power supply and each semiconductor device. These intermediary switches can be independently controlled to disconnect defective devices from the test circuit, preventing short-circuits from propagating to other devices while maintaining the simultaneous testing capability.
2Reliability
If voltage application is continued after a deficiency occurs in a semiconductor device, then the test can be completed for other devices, but the test circuit is short-circuited by the defective device
Solution Approach 1:
The control circuit implements preliminary anti-action by monitoring leak currents of each semiconductor device and preemptively activating the first switch and second switch to disconnect defective devices before they can cause short-circuits to affect the test circuit and other devices. This prevents the harmful short-circuit effect while maintaining test continuity.
Solution Approach 2:
The test circuit incorporates feedback mechanisms through leak current detection for each semiconductor device. The control circuit receives feedback information about the status of each device and automatically adjusts the switch states to disconnect defective devices, preventing short-circuits while allowing continuous testing of good devices.
Data Source
AI summary
A semiconductor test apparatus includes: a power supply; a high-voltage wire connecting high-voltage terminals of a plurality of semiconductor devices which are objects to be tested to a high-voltage side of the power supply; a low-voltage wire connecting low-voltage terminals of the semiconductor devices to a low-voltage side of the power supply; first switches connected in series to the semiconductor devices respectively, each of the first switches having one end connected to the low-voltage side of the power supply via the low-voltage wire and other end connected to the low-voltage terminal; second switches connected to the semiconductor devices respectively, each of the second switches having one end connected to the high-voltage terminal and other end connected to the low-voltage terminal; and a control circuit controlling the first switches and the second switches.