Semiconductor Test Jig Insulating Material for Breakdown Voltage
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Solution Overview
Problem
Conventional methods for measuring the breakdown voltage of wide bandgap semiconductor chips are hindered by atmosphere discharge, leading to inaccurate measurements and potential chip damage, and are costly due to the need for insulation solutions.
Innovation Solution
A jig with a base and stage that surrounds a probe pin with insulating material, allowing the pin to contact the chip's electrode and the insulating material to contact both the chip and stage, preventing atmosphere discharge and enabling accurate breakdown voltage measurement without costly solutions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a high voltage is applied to the probe pin contacting the surface electrode and the stage contacting the back electrode for measurement, then the breakdown voltage can be measured, but insulation breakdown is generated between the surface electrode and the stage causing atmosphere discharge
Solution Approach 1:
An insulating material is introduced as an intermediary between the stage and the semiconductor chip. This insulating material has a ground electrode that contacts the stage and a measurement electrode that contacts the back electrode of the chip, thereby mediating the electrical connection while preventing direct insulation breakdown between the stage and the chip's surface electrode.
Solution Approach 2:
The electrical connection path is segmented into multiple stages: the stage connects to the ground electrode of the insulating material, which connects to the measurement electrode, which in turn connects to the back electrode of the chip. This segmentation isolates the high voltage application from the stage, preventing atmosphere discharge.
2Volume of moving object
If the terminal structure is shrunk to maintain breakdown voltage securely, then the chip size can be reduced, but the insulation breakdown electric field of atmosphere becomes smaller making creeping discharge easier to generate
Solution Approach 1:
The insulating material acts as a mediator that extends the insulation path between the stage and the chip's surface electrode. By introducing this intermediate insulating layer, the effective insulation distance is increased without increasing the chip's physical dimensions, thereby preventing creeping discharge while maintaining compact chip size.
3Object-affected harmful factors
If insulation solution is used to avoid atmosphere discharge, then discharge can be prevented, but the measurement system becomes costly
Solution Approach 1:
The insulating material is designed as a simple, inexpensive component that can be easily manufactured and replaced if needed. It provides effective insulation without requiring complex insulation solution systems, thereby preventing atmosphere discharge while keeping the measurement system cost-effective.
Solution Approach 2:
The invention extracts the essential insulation function from the complex insulation solution system and implements it through a simple insulating material with ground and measurement electrodes. This extraction eliminates the need for costly insulation solution supply and drainage units while maintaining discharge prevention capability.
Data Source
AI summary
A jig for use in a semiconductor test of the present invention includes; a base on which a probe pin and an insulating material are provided such that the probe pin is surrounded by the insulating material in plan view; and a stage arranged to face a surface of the base on which the probe pin and the insulating material are provided. The stage is capable of receiving a test object placed on a surface facing the base. When the test object is placed on the stage and the base and the stage move in a direction in which they get closer to each other, the probe pin comes into contact with an electrode formed on the test object, and the insulating material comes into contact with both the test object and the stage.