Semiconductor Test Jig Insulating Material Discharge Prevention
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Solution Overview
Problem
Conventional semiconductor test jigs fail to prevent discharge at the terminal portion of wide-gap semiconductor chips during high-voltage tests, even when the terminal portion shrinks, leading to manufacturing inefficiencies and increased costs.
Innovation Solution
A semiconductor test jig is designed with a base and stage configuration where a probe pin and insulating material surround the probe pin, allowing the insulating material to contact the test object, thereby maintaining a longer insulation distance between ground and high-potential surfaces, preventing discharge during tests.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the terminal portion shrinks to reduce manufacturing costs, then manufacturing cost is reduced, but discharge is generated at the terminal portion during high-voltage tests
Solution Approach 1:
An insulating material is introduced as an intermediary between the probe pin and the terminal portion of the semiconductor chip. This insulating material contacts the terminal portion and prevents discharge by providing electrical insulation, allowing the terminal portion to be shrunk without causing discharge during high-voltage tests.
Solution Approach 2:
The insulating material is designed as a simple, inexpensive component that can be easily replaced. It serves as a disposable protective element that prevents discharge during testing without requiring complex or expensive modifications to the semiconductor chip structure.
2Area of moving object
If the terminal portion shrinks, then the area of the terminal portion is reduced, but the insulation distance becomes insufficient leading to discharge
Solution Approach 1:
The insulating material acts as a mediator that extends the effective insulation distance despite the reduced terminal portion area. By placing this insulating material between the probe pin and the terminal portion, sufficient insulation is maintained even when the terminal portion is shrunk.
Solution Approach 2:
Instead of increasing the insulation distance in the horizontal plane (which would require larger terminal portion area), the solution introduces insulation in the vertical dimension by placing insulating material between the probe pin and terminal portion, effectively extending insulation distance without increasing area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The jig effectively prevents discharge at the terminal portion of semiconductor chips during tests, ensuring reliable and efficient testing by maintaining insulation between high-potential and ground surfaces, even as the terminal portion shrinks, thus reducing manufacturing costs and improving test reliability.
Implementation Method 1
the insulating material comes into contact with the test object... maintaining a longer insulation distance between ground and high-potential surfaces, preventing discharge during tests
Data Source
AI summary
A jig for use in a semiconductor test includes: a base on which a probe pin and an insulating material are placed, the insulating material surrounding the probe pin in plan view; and a stage arranged to face a surface of the base on which the probe pin and the insulating material are placed. The stage is capable of holding a test object on a surface of the stage facing the base. When the base and the stage move in a direction in which they go closer to each other while the test object is placed on the stage, the probe pin comes into contact with an electrode formed on the test object and the insulating material comes into contact with the test object.